tag: aging

Taming Corner Explosion In Complex Chips
By Brian Bailey - 23 Feb, 2023 - Comments: 0

There is a tenuous balance between the number of corners a design team must consider, the cost of analysis, and the margins they insert to deal with them, but that tradeoff is becoming a lot more difficult. If too many corners of a chip are explored, it might never see production. If not enough corners are explored, it could reduce yield. And if too much margin is added, the device may not be c... » read more

Safety, Security, And Reliability Of AI In Autos
By Ed Sperling - 22 Feb, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about security, aging, and safety in automotive AI systems, with Geoff Tate, CEO of Flex Logix; Veerbhan Kheterpal, CEO of Quadric; Steve Teig, CEO of Perceive; and Kurt Busch, CEO of Syntiant. What follows are excerpts of that conversation, which was held in front of a live audience at DesignCon. Part one of this discussion is he... » read more

Safeguarding SRAMs From IP Theft (Best Paper Award)
By Technical Paper Link - 15 Dec, 2022 - Comments: 0

A technical paper titled "Beware of Discarding Used SRAMs: Information is Stored Permanently" was published by researchers at Auburn University. The paper won "Best Paper Award" at the IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE) Oct. 25-27 in Huntsville. Abstract: "Data recovery has long been a focus of the electronics industry for decades by s... » read more

The Reliability Of Analog Integrated Circuits And Their Simulation-Aided Verification
By Andre Lange - 19 Jul, 2022 - Comments: 0

Different challenges have to be overcome when designing integrated circuits. Besides schematic and layout design work, verification in view of the non-ideal behavior of circuits and semiconductor technologies in particular is also relevant. The designed circuits have to work at specific operating voltages and within ambient temperature ranges and be robust in terms of process fluctuations ... » read more

Variation Making Trouble In Advanced Packages
By Ed Sperling - 16 Jun, 2022 - Comments: 2

Variation is becoming increasingly problematic as chip designs become more heterogeneous and targeted by application, making it difficult to identify the root cause of problems or predict what can go wrong and when. Concerns about variation traditionally have been confined to the most advanced nodes, where transistor density is highest and where manufacturing processes are still being fine-t... » read more

Closing The Post-Silicon Timing Analysis Gap
By Ash Patel - 10 May, 2022 - Comments: 0

Accurate static timing analysis is one of the most important steps in the development of advanced node semiconductor devices. Performance numbers are included in chip and system specifications from the earliest marketing requirements. The architects and designers carefully determine clock cycle times that can achieve the required performance using the chosen high-level architecture, micro-archi... » read more

Lots Of Data, But Uncertainty About What To Do With It
By Ed Sperling - 09 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about silicon lifecycle management in heterogeneous designs, where sensors produce a flood of data, with Prashant Goteti, principal engineer at Intel; Rob Aitken, R&D fellow at Arm; Zoe Conroy, principal hardware engineer at Cisco; Subhasish Mitra, professor of electrical engineering and computer science at Stanford University... » read more

Always-On, Ultra-Low-Power Design Gains Traction
By Ann Mutschler - 14 Apr, 2022 - Comments: 0

A surge of electronic devices powered by batteries, combined with ever-increasing demand for more features, intelligence, and performance, is putting a premium on chip designs that require much lower power. This is especially true for always-on circuits, which are being added into AR/VR, automotive applications with over-the-air updates, security cameras, drones, and robotics. Also known as ... » read more

Assuring Reliable Processor Performance At Scale
By Uzi Baruch - 08 Mar, 2022 - Comments: 0

In today’s data center environment, resilience is key. Cloud providers are built on as-a-service business models, where uptime is critical to ensure their customers’ business continuity. Reputation and competitiveness require service at extremely high performance, low power, and increasing functionality, with zero tolerance for unplanned downtime or errors. If you’re a hyperscaler, o... » read more

Preparing For 3D-ICs
By Ed Sperling - 16 Feb, 2022 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at Ansys; Kenneth Larsen, product marketing director at Synopsys; Tony Mastroianni, advanced packaging solutions director at Siemens EDA; and Vinay Patwardhan, product management group director at Cadence... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy