Generative AI: Transforming Inference At The Edge


The world is witnessing a revolutionary advancement in artificial intelligence with the emergence of generative AI. Generative AI generates text, images, or other media responding to prompts. We are in the early stages of this new technology; still, the depth and accuracy of its results are impressive, and its potential is mind-blowing. Generative AI uses transformers, a class of neural network... » read more

AI, Rising Chip Complexity Complicate Prototyping


Prototyping, an essential technology for designing complex chips in tight market windows, is becoming significantly more challenging for the growing number of designs that include AI/ML. Prototyping remains one of the foundational pillars of the whole shift left movement, allowing software to be developed and tested before actual silicon is available. That, in turn, enables multiple teams t... » read more

The Power Of Computational Software: From Revolutionizing Chips To Cancer Research


This post is an excerpt from the keynote presentation at CadenceLIVE India, given by Nimish Modi, senior vice president and general manager of Strategy and New Ventures at Cadence. The semiconductor industry has grown significantly lately but follows a cyclical pattern marked by fluctuations. Currently, we are witnessing a macro-level correction aimed at resolving inventory imbalances. N... » read more

Using Data More Effectively In Chip Manufacturing


Experts at the Table: Semiconductor Engineering sat down to discuss smart manufacturing and how tools and AI can enable it for semiconductors, with Mujtaba Hamid, general manager for product management for secure cloud environments at Microsoft; Vijaykishan Narayanan, vice president and general manager of India engineering and operations at proteanTecs; KT Moore, vice president of corporate ma... » read more

AI Process Control Platform Enabling Next Generation Technology


PAICe Monitor delivers AI and machine learning-enabled analytics for all stages of the semiconductor fabrication process lifecycle — from process development and ramp readiness, to high volume production. Leveraging Tignis’ Digital Twin Query Language, PAICe Monitor enables process engineers to transform in-product fault diagnoses into continuous real-time monitoring—greatly improving ... » read more

Neuromorphic Computing: Graphene-Based Memristors For Future AI Hardware From Fabrication To SNNs


A technical paper titled “A Review of Graphene-Based Memristive Neuromorphic Devices and Circuits” was published by researchers at James Cook University (Australia) and York University (Canada). Abstract: "As data processing volume increases, the limitations of traditional computers and the need for more efficient computing methods become evident. Neuromorphic computing mimics the brain's... » read more

Week In Review: Manufacturing, Test


TSMC, Bosch, Infineon, and NXP will jointly invest in the European Semiconductor Manufacturing Co. (ESMC), in Dresden, Germany, to provide advanced semiconductor manufacturing services. ESMC marks a significant step toward construction of a 300mm fab, which is expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers on TSMC’s 28/22nm planar CMOS and 16/12nm finFET proce... » read more

Processor Tradeoffs For AI Workloads


AI is forcing fundamental shifts in chips used in data centers and in the tools used to design them, but it also is creating gaps between the speed at which that technology advances and the demands from customers. These shifts started gradually, but they have accelerated and multiplied over the past year with the rollout of ChatGPT and other large language models. There is suddenly much more... » read more

Developing Energy-Efficient AI Accelerators For Intelligent Edge Computing And Data Centers


Artificial intelligence (AI) accelerators are deployed in data centers and at the edge to overcome conventional von Neumann bottlenecks by rapidly processing petabytes of information. Even as Moore’s law slows, AI accelerators continue to efficiently enable key applications that many of us increasingly rely on, from ChatGPT and advanced driver assistance systems (ADAS) to smart edge device... » read more

Tradeoffs In DSP Design


More intelligence is now required in the front-, mid-, and back-haul for 5G/6G communication, requiring a mix of high performance, low power, and enough flexibility to accommodate constantly changing protocols and algorithms. One solution to these conflicting goals involves reconfigurable DSPs, in which the processing element is hardwired like an ASIC but still configurable for a variety of app... » read more

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