Research Bits: March 29


Brain-like AI chip Researchers from Purdue University, Santa Clara University, Portland State University, Pennsylvania State University, Argonne National Laboratory, University of Illinois Chicago, Brookhaven National Laboratory, and University of Georgia built a reprogrammable chip that could be used as the basis for brain-like AI hardware. “The brains of living beings can continuously l... » read more

Week In Review: Manufacturing, Test


Worldwide fab equipment spending for front-end manufacturing is expected to hit $107 billion this year, an 18% year-over-year increase, according to SEMI’s latest World Fab Forecast report. “Crossing the $100 billion mark in spending on global fab equipment for the first time is a historic milestone for the semiconductor industry,” said Ajit Manocha, president and CEO of SEMI. Investme... » read more

Autonomous Design Automation: How Far Are We?


The year is 2009, during the Design Automation Conference (DAC) at a press dinner in a posh little restaurant in San Francisco’s Civic Center. About two glasses of red wine in, one of the journalists challenges the table: “So, how far away are we from the black box that we feed with our design requirements and it produces the design that we send to the foundry?” We discussed all the indus... » read more

Embedded AI On L-Series Cores


Over the last few years there has been an important shift from cloud-level to device-level AI processing. The ability to run AI/ML tasks becomes a must-have when selecting an SoC or MCU for IoT and IIoT applications. Embedded devices are typically resource-constrained, making it difficult to run AI algorithms on embedded platforms. This paper looks at what could make it easier from a softwar... » read more

Cataloging IP In The Enterprise


Many companies have no way of documenting where IP they license is actually used, which version of that IP is being utilized, and whether that license extends to other projects or even to their customers. Pedro Pires, applications engineer at ClioSoft, looks at how IP currently is cataloged, why it’s been so difficult to do this in the past, and how AI can be used to speed up and simplify thi... » read more

Seven Hardware Advances We Need to Enable The AI Revolution


The potential, positive impact AI will have on society at large is impossible to overestimate. Pervasive AI, however, remains a challenge. Training algorithms can take inordinate amounts of power, time, and computing capacity. Inference will also become more taxing with applications such as medical imaging and robotics. Applied Materials estimates that AI could consume up to 25% of global elect... » read more

Why Comparing Processors Is So Difficult


Every new processor claims to be the fastest, the cheapest, or the most power frugal, but how those claims are measured and the supporting information can range from very useful to irrelevant. The chip industry is struggling far more than in the past to provide informative metrics. Twenty years ago, it was relatively easy to measure processor performance. It was a combination of the rate at ... » read more

Robots Become More Useful In Factories


Most people associate factory automation with large robotic machines, such as those that weld automobile chassis on assembly lines. But as prices drop and technology improves, robots are being deployed for smaller and more varied tasks, and they are getting better at all of them. Inside of factories, robots can significantly improve output, consistency, and reliability. They can work around ... » read more

A Practical Approach To DFT For Large SoCs And AI Architectures, Part II


By Rahul Singhal and Giri Podichetty Part I of this article discusses the design-for-test (DFT) challenges of AI designs and strategies to address them at the die level. This part focuses on the test requirements of AI chips that integrate multiple dies and memories on the same package. Why 2.5D/3D chiplet-based designs for AI SoCs? Many semiconductor companies are adopting chiplet-based d... » read more

Next-Gen Transistors


Nanosheets, or more generally, gate-all-around FETs, mark the next big shift in transistor structures at the most advanced nodes. David Fried, vice president of computational products at Lam Research, talks with Semiconductor Engineering about the advantages of using these new transistor types, along with myriad challenges at future nodes, particularly in the area of metrology. » read more

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