tag: AI

Always-On DSPs
By Ed Sperling - 28 Dec, 2021 - Comments: 0

There are tradeoffs between powering circuits down to save power and waking them up to respond to voice and visual commands. Prakash Madhvapathy, director of product marketing and product management at Cadence, talks about the best ways to deploy digital signal processors, why multiple DSPs are often better than just one, and what penalties there are for various approaches. » read more

The High But Often Unnecessary Cost Of Coherence
By Brian Bailey - 22 Dec, 2021 - Comments: 4

Cache coherency, a common technique for improving performance in chips, is becoming less useful as general-purpose processors are supplemented with, and sometimes supplanted by, highly specialized accelerators and other processing elements. While cache coherency won't disappear anytime soon, it is increasingly being viewed as a luxury necessary to preserve a long-standing programming paradig... » read more

Flexible USB4-Based Interface IP Solution For AI At The Edge
By Synopsys - 21 Dec, 2021 - Comments: 0

Consumers have become accustomed to smart devices that are powered by advances in artificial intelligence (AI). To expand the devices’ total addressable market, innovative device designers build edge AI accelerators and edge AI SoCs that support multiple use cases and integration options. This white paper describes a flexible USB4-based IP solution for edge AI accelerators and SoCs. The IP so... » read more

An Event-Driven and Fully Synthesizable Architecture for Spiking Neural Networks
By Technical Paper Link - 20 Dec, 2021 - Comments: 0

Abstract:  "The development of brain-inspired neuromorphic computing architectures as a paradigm for Artificial Intelligence (AI) at the edge is a candidate solution that can meet strict energy and cost reduction constraints in the Internet of Things (IoT) application areas. Toward this goal, we present μBrain: the first digital yet fully event-driven without clock architecture, with co-lo... » read more

Next Steps For Panel-Level Packaging
By Mark LaPedus - 20 Dec, 2021 - Comments: 1

Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel-level processing. Fraunhofer IZM recently announced a new phase of its panel-level packaging consortium. What follows are excerpts of that discussion. SE: IC packaging isn’t new, but years a... » read more

The Return Of DAC In-Person
By Brian Bailey - 15 Dec, 2021 - Comments: 0

Apart from masked faces everywhere, you could be excused for not knowing that there was a pandemic going on. Sure, the numbers were down, the show floor was smaller, and most of the parties didn't happen, but everyone was so happy to be able to bump elbows with their colleagues. Buttons were available for attendees to show the level of comfort they had with various types of greetings, from "... » read more

Amdahl Limits On AI
By Brian Bailey - 09 Dec, 2021 - Comments: 0

Software and hardware both place limits on how fast an application can run, but finding and eliminating the limitations is becoming more important in this age of multicore heterogeneous processing. The problem is certainly not new. Gene Amdahl (1922-2015) recognized the issue and published a paper about it in 1967. It provided the theoretical speedup for a defined task that could be expected... » read more

Innovations In Sensor Technology
By John Koon - 09 Dec, 2021 - Comments: 0

Sensors are the “eyes” and “ears” of processors, co-processors, and computing modules. They come in all shapes, forms, and functions, and they are being deployed in a rapidly growing number of applications — from edge computing and IoT, to smart cities, smart manufacturing, hospitals, industrial, machine learning, and automotive. Each of these use cases relies on chips to capture d... » read more

The Future Of Smart Cameras Is 64-Bit Processing
By Parag Beeraka - 09 Dec, 2021 - Comments: 0

The future of smart camera technology brings with it profound transformations in the way we interact with each other and the world around us. From smart cities that are safer and more efficient to rainforests that are monitored for illegal logging, the increasing need for advanced vision technology is growing. Diverse and complex use cases leveraging artificial intelligence (AI) and machine lea... » read more

Veloce Prototyping Solutions Accelerate Verification Of HPC AI-Enabled SoCs
By Siemens EDA - 08 Dec, 2021 - Comments: 0

This white paper goes through the journey of understanding how to meet quality requirements and accelerate time-to-market for your company’s latest flagship high performance computing (HPC) artificial intelligence (AI)-enabled system-on-chip (SoC) design. The starting point in the journey explores the use cases for designs illustrating the impact HPC AI-enabled systems and resources have on o... » read more

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