Heterogeneous IC Packaging: Optimizing Performance And Cost

By Mike Kelly - 18 Aug, 2022 - Comments: 0

Leading integrated circuit (IC) foundries are already shipping 7-nm and 5-nm wafers and 3-nm product qualifications are ongoing. Wafer costs continue to soar as high transistor density requires ever more expensive processes to fabricate them. Even if defect densities can remain relatively flat as new nodes emerge, the cost per unit area of silicon increases nonlinearly. These economics have pla... » read more

Making The Most Of Data Lakes

By Anne Meixner - 09 Aug, 2022 - Comments: 0

Having all the semiconductor data available is increasingly necessary for improving manufacturability, yield, and ultimately the reliability of end devices. But without sufficient knowledge of relationships between data from different processes and computationally efficient data structures, the value of any data is significantly reduced. In the semiconductor industry, reducing waste, decreas... » read more

Week In Review, Manufacturing, Test

By Karen Heyman - 05 Aug, 2022 - Comments: 1

Post-CHIPS Act Micron is discussing a potential new fab that could employ thousands of workers, following the passage of the Chips and Science Act. Idaho is hoping it will be built near its headquarters facilities in Boise, but Micron hasn’t committed publicly. Rob Beard, senior vice president, general counsel and corporate secretary at Micron, told the Idaho Statesman the company is consi... » read more

Scaling, Advanced Packaging, Or Both

By Ed Sperling - 01 Aug, 2022 - Comments: 0

Chipmakers are facing a growing number of challenges and tradeoffs at the leading edge, where the cost of process shrinks is already exorbitant and rising. While it's theoretically possible to scale digital logic to 10 angstroms (1nm) and below, the likelihood of a planar SoC being developed at that nodes appears increasingly unlikely. This is hardly shocking in an industry that has heard pr... » read more

IC Package Illustrations, From 2D To 3D

By Tyler DeHaan - 21 Jul, 2022 - Comments: 1

In five words or less can you describe what a semiconductor is? Some might say a computer chip, others may say they are "space magic," but I would venture that most people have never heard the word before and would simply say "I have no idea." I was certainly a part of the latter crowd before I began my internship with Amkor Technology where I was brought on board as a 3D illustrator to create ... » read more

Enabling The 5G RF Front-End Module Evolution With The DSMBGA Package

By Amkor - 21 Jul, 2022 - Comments: 0

The advanced SiP double-sided molded BGA platform has become an industry technology standard in this domain. Applying leading-edge design rules for 3D component placement and double-sided molding, together with conformal and compartmental shielding and in-line RF testing, delivers integration levels in a small form factor with high yield. In addition to formidable SiP capacity and DSMBGA techno... » read more

Variation Making Trouble In Advanced Packages

By Ed Sperling - 16 Jun, 2022 - Comments: 2

Variation is becoming increasingly problematic as chip designs become more heterogeneous and targeted by application, making it difficult to identify the root cause of problems or predict what can go wrong and when. Concerns about variation traditionally have been confined to the most advanced nodes, where transistor density is highest and where manufacturing processes are still being fine-t... » read more

Revising 5G RF Calibration Procedures For RF IC Production Testing

By Amkor - 16 Jun, 2022 - Comments: 0

Modern radio frequency (RF) components introduce many challenges to outsourced semiconductor assembly and test (OSAT) suppliers whose objective is to ensure products are assembled and tested to meet the product test specifications. The growing advancement and demand for RF products for cellphones, navigational instruments, global positioning systems, Wi-Fi, receiver/transmitter (Rx/Tx) componen... » read more

Keeping IC Packages Cool

By Laura Peters and Karen Heyman - 07 Jun, 2022 - Comments: 0

Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost performance and reduce power, they are wrestling with a whole new set of heat-related issues. The shift to advanced packaging enables chipmakers to meet demands for increasing bandwidth, clock speeds, and power density for high perform... » read more

The Race To Zero Defects In Auto ICs

By Anne Meixner - 07 Jun, 2022 - Comments: 0

Assembly houses are fine-tuning their methodologies and processes for automotive ICs, optimizing everything from inspection and metrology to data management in order to prevent escapes and reduce the number of costly returns. Today, assembly defects account for between 12% and 15% of semiconductor customer returns in the automotive chip market. As component counts in vehicles climb from the ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

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