tag: ANSYS

Blog Review: Oct. 5
By Jesse Allen - 05 Oct, 2022 - Comments: 0

Arm's Andrew Pickard chats with Georgia Tech's Azad Naeemi and Da Eun Shim about an effort to evaluate the benefit of new interconnect materials and wire geometry and determine their impacts at the microprocessor level. Synopsys' Shekhar Kapoor shares highlights from a recent panel exploring the promises, challenges, and realities of 3D IC technology, including the potential of 3D nanosystem... » read more

Chip Industry’s Technical Paper Roundup: Oct. 4
By Linda Christensen - 04 Oct, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=55 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

Coming In Hot: Requirements For Successful Thermal Management In 3D-IC
By Marc Swinnen - 03 Oct, 2022 - Comments: 0

As the speed, density, and capabilities of electronics have all increased, power has become a first order driver in almost all electronic systems. For instance, it’s well recognized that heat is often the number one limiting factor in 3D-IC design. High-speed chips stacked close together in a small housing cause things to heat up fast. One of the most common designer responses to overheating ... » read more

Speeding-Up Thermal Simulations Of Chips With ML
By Technical Paper Link - 02 Oct, 2022 - Comments: 0

A new technical paper titled "A Thermal Machine Learning Solver For Chip Simulation" was published by researchers at Ansys. Abstract "Thermal analysis provides deeper insights into electronic chips' behavior under different temperature scenarios and enables faster design exploration. However, obtaining detailed and accurate thermal profile on chip is very time-consuming using FEM or CFD. Th... » read more

Blog Review: Sept. 28
By Jesse Allen - 28 Sep, 2022 - Comments: 0

Cadence's Paul McLellan shares more highlights from the recent Hot Chips, including some very large chips and accelerators for AI and deep learning, new networks and switches, and mobile and edge processors. Synopsys' Marc Serughetti considers the different use cases for digital twins in automotive and how they can help determine the impact of software on verification, test, and validation a... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 23 Sep, 2022 - Comments: 0

Automotive, mobility Siemens Digital Industries Software and climate-tech company sustamize devised a way to add carbon emissions data to Siemens Xcelerator. Siemens created its Teamcenter Carbon Footprint Calculator software to help teams measure, simulate, reduce, and track their product carbon footprint early in the development phase. The calculator uses sustamize’s Product Footprint Engi... » read more

Blog Review: Sept. 21
By Jesse Allen - 21 Sep, 2022 - Comments: 0

Arm's Neil Burgess and Sangwon Ha explain why they've joined Intel and Nvidia in proposing a new 8-bit floating point specification to enable neural network models developed on one platform to be run on other platforms without encountering the overhead of having to convert the vast amounts of model data between formats while reducing task loss to a minimum. Synopsys' Manuel Mota examines ver... » read more

Thermal Simulation Of DSMBGA And Coupled Thermal-Mechanical Simulation Of Large Body HDFO
By Nathan Whitchurch - 15 Sep, 2022 - Comments: 0

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that were once separate components on a printed circuit board (PCB) have now been relocated along with all their associated passive devices and interconnects into single System in Package (SiP) style suba... » read more

Blog Review: Sept. 14
By Jesse Allen - 14 Sep, 2022 - Comments: 0

Synopsys' Godwin Maben, Piyush Sancheti, and Hany Elhak examine some of the top chip design considerations for medical devices and why they require careful analysis of power to reduce the number surgeries to replace batteries, reliability for devices that can be expected to last for ten years or more, and security to protect private medical data and prevent breaches. Siemens' Chris Spear exp... » read more

Designing For Thermal
By Karen Heyman - 13 Sep, 2022 - Comments: 0

Heat has emerged as a major concern for semiconductors in every form factor, from digital watches to data centers, and it is becoming more of a problem at advanced nodes and in advanced packages where that heat is especially difficult to dissipate. Temperatures at the base of finFETs and GAA FETs can differ from those at the top of the transistor structures. They also can vary depending on h... » read more

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