tag: ANSYS

Enabling Accurate Electronic-Photonic Co-Design with a Synergetic Workflow on GlobalFoundries Fotonix Platform
By Ansys - 09 Nov, 2022 - Comments: 0

Massive growth in research, development, and applications of CMOS-compatible integrated photonics in recent years, along with its expected potential for the years to come, has sparked an ever-increasing demand from designers for seamless and all-inclusive design automation solutions that can enable electronic-photonic co-design while being accurate and easy to use. Here, we demonstrate an end-t... » read more

Week In Review: Design, Low Power
By Marie C. Baca - 04 Nov, 2022 - Comments: 0

Earnings and Acquisitions Siemens will acquire Avery Design Systems, a simulation-independent verification IP supplier, in the first quarter of fiscal year 2023. The terms of the transaction were not disclosed. Siemens executives say the acquisition will “enhance Siemens’ offerings across mainstream verification IP segments, while further extending Siemens verification solutions into area... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 04 Nov, 2022 - Comments: 0

Automotive, mobility Saudi Arabia has launched an electric vehicle (EV) company called Ceer. The company is a joint venture between the Public Investment Fund (PIF) of Saudia Arabia and Foxconn (Hon Hai Precision Industry Co.). SiMa.ai, a four-year-old startup that designs edge machine learning SoCs used in vision applications, is getting into the automotive assisted driving market. The com... » read more

AI Feeds Vision Processor, Image Sensor Boom
By SE Staff - 03 Nov, 2022 - Comments: 0

Vision systems are rapidly becoming ubiquitous, driven by big improvements in image sensors as well as new types of sensors. While the sensor itself often is developed using mature-node silicon, increasingly it is connected to vision processors developed at the most advanced process nodes. That allows for the highest performance per watt, and it also allows designs to incorporate AI accelera... » read more

Blog Review: Nov. 2
By Jesse Allen - 02 Nov, 2022 - Comments: 0

Siemens EDA's Harry Foster examines how successful FPGA projects are in terms of verification effectiveness, finding that only 16% of all FPGA projects were able to achieve no non-trivial bug escapes into production, worse than IC/ASIC in terms of first silicon success. Synopsys' Jamie Boote and The Chertoff Group's David London break down best practice guidance and directives U.S. governmen... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 28 Oct, 2022 - Comments: 0

This week saw more fallout from U.S. export controls: SK hynix may consider selling its memory chip production facilities in China if recently imposed controls make it too difficult to continue operations there, according to Nikkei Asia. "As a contingency plan, we are considering selling the fab, selling the equipment or transferring the equipment to South Korea," said Kevin Noh, SK hynix ... » read more

Week In Review: Design, Low Power
By Marie C. Baca - 28 Oct, 2022 - Comments: 0

Tools and IP Scandinavian researchers used a laser-powered chip to transmit about 1.84 petabytes of data over a fiber optic cable in one second. The scientists said the technology could lead to faster broadband speeds and reduce the amount of energy used to keep the internet running. Imec said the semiconductor industry is likely to see increasing separation of power delivery and signal rou... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 28 Oct, 2022 - Comments: 0

Automotive, mobility Ford Motor Company revealed it lost $827 million in the third quarter because of parts shortages and unexpected supplier costs. Those shortages affected 40,000 to 50,000 vehicles. The company is shutting down its interest in its self-driving car unit Argo.ai, which it shared with Volkswagen since 2019. Ford will instead focus on advanced driver-assist systems (ADAS), which... » read more

What’s So Different About Interposer Signal Integrity?
By Kelly Damalou - 28 Oct, 2022 - Comments: 0

By Kelly Damalou and Pete Gasperini To achieve gains in power, performance, area, and cost, 3D-IC architectures are pushing electronics design to new limits. Silicon integration technology and associated devices have undergone an impressive evolution over the last several decades. Their development encourages technological advancement in applications like high-performance computing, Artificial... » read more

Raising IP Integration Up A Level
By Brian Bailey - 27 Oct, 2022 - Comments: 0

An increase in the number and complexity of IP blocks, coupled with changing architectures and design concerns, are driving up the need for new tools that can enable, automate, and optimize integration in advanced chips and packages. Power, security, verification and a host of other issues are cross-cutting concerns, and they make pure hierarchical approaches difficult. Adding to future comp... » read more

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