tag: ANSYS

Mapping Heat Across A System
By Ann Mutschler - 13 May, 2021 - Comments: 0

Thermal issues are becoming more difficult to resolve as chip features get smaller and systems get faster and more complex. They now require the integration of technologies from both the design and manufacturing flows, making design for power and heat a much broader problem. This is evident with the evolution of a smart phone. Phones sold 10 years ago were very different devices. Functionali... » read more

Building Better Batteries With Parameter Characterization
By Chris South - 13 May, 2021 - Comments: 0

By Chris South and Theresa Duncan The global economy is rapidly transitioning to portable and storable electricity, which impacts every major technology sector, especially consumer electronics, clean energy, and mobility/transportation. The electric vehicle (EV) market, in particular, has seen a significant uptick in sales in the past decade. According to BloombergNEF, by 2040 over half of ... » read more

Blog Review: May 12
By Jesse Allen - 12 May, 2021 - Comments: 0

Cadence's Claire Ying points to major changes in PCIe 6.0 as PAM4 signaling replaces NRZ to help double bandwidth, Forward Error Correction helps maintain data integrity, and various improvements are made to power consumption. Synopsys' Samantha Beaumont argues that automotive sensors are a major potential attack point and addresses some of the key areas of sensor vulnerability and the chall... » read more

Study On High-Performance Computing Usage For Engineering Simulation
By Ansys - 12 May, 2021 - Comments: 0

Simulation will play a critical role in the development of new market disrupting technology, from autonomous vehicles to 5G cellular networks, and the need for on-premises or cloud-based HPC resources to support those efforts is only going to increase. This white paper explores: How companies are using HPC-based simulation. The effect of the COVID-19 pandemic on HPC usage and adoptio... » read more

Week In Review: Design, Low Power
By Jesse Allen - 07 May, 2021 - Comments: 0

Synopsys completed its acquisition of MorethanIP, a provider of Ethernet Digital Controller IP supporting data rates from 10G to 800G. The acquisition adds MAC (Medium Access Controller) and PCS (Physical Coding Sublayer) for 200G/400G and 800G Ethernet to Synopsys’ portfolio. The company also provides Time-Sensitive Networking, Fibre Channel, and Ethernet Switching IP for integration into AS... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 07 May, 2021 - Comments: 0

Pervasive computing — IoT, edge, cloud, data center, and back Foxconn (also known as Hon Hai Technology Group) is forming a joint venture (JV) with Yageo Group, a component production and process management company for EVs and other high-end electronics, to focus on the development of semiconductors under $2 USD, which they call “small ICs.” Through the JV, a new company called XSemi wil... » read more

Innovations In High-Frequency Electromagnetic Simulation
By Rick Petersson - 07 May, 2021 - Comments: 0

High-frequency electromagnetic simulation has evolved from “wow, now I can see how electromagnetic fields behave” to needing to know how various EM fields interact in large, complex systems. During that time, I have been an R&D engineer and I have managed a team implementing various solver technologies. We’ve been presented with plenty of challenges as electronics have continued to pr... » read more

Blog Review: May 5
By Jesse Allen - 05 May, 2021 - Comments: 0

Arm's William Wang considers how to increase the performance and programmability of persistent applications through using battery to protect the on-chip volatile cache hierarchy. Cadence's Paul McLellan finds that ransomware is getting more sophisticated, and more difficult to eradicate and defend against, with potentially life-threatening consequences. Synopsys' Jonathan Knudsen digs int... » read more

Steep Spike For Chip Complexity And Unknowns
By Ed Sperling - 05 May, 2021 - Comments: 0

Cramming more and different kinds of processors and memories onto a die or into a package is causing the number of unknowns and the complexity of those designs to skyrocket. There are good reasons for combining all of these different devices into an SoC or advanced package. They increase functionality and can offer big improvements in performance and power that are no longer available just b... » read more

Blog Review: April 28
By Jesse Allen - 28 Apr, 2021 - Comments: 0

Arm's Tiago Azevedo explains why it's important to measure uncertainty when using object detection, especially in critical applications such as automotive, and introduces a architecture that can do so while balancing complexity and efficiency. Cadence's Paul McLellan digs into the ISO 21434 standard for addressing and managing cybersecurity risks in vehicles and why it's a good sign for secu... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy