tag: ANSYS

Design For Reliability
By Brian Bailey - 15 Feb, 2021 - Comments: 1

Circuit aging is emerging as a mandatory design concern across a swath of end markets, particularly in markets where advanced-node chips are expected to last for more than a few years. Some chipmakers view this as a competitive opportunity, but others are unsure we fully understand how those devices will age. Aging is the latest in a long list of issues being pushed further left in the desig... » read more

Analysis And Development of Safety-Critical Embedded Systems
By Ansys - 13 Feb, 2021 - Comments: 0

Today’s automobiles and airplanes feature more electronic components than ever. Hundreds of connected systems enable safety-critical functions like braking, acceleration, steering, navigation and communication. Ansys has the only comprehensive simulation solution for designing safe, reliable systems — including hardware, electronics and embedded software — for human-controlled and autonom... » read more

Modeling PCBs For Common Causes Of Failure
By Theresa Duncan - 11 Feb, 2021 - Comments: 0

By Theresa Duncan and Michael Blattau When designing printed circuit boards (PCBs), keep in mind the major causes of electronic failure: thermal cycling, vibration, and mechanical shock and drop. You can perform a variety of physical tests to determine how and why electronics fail, however, a much faster and cost-effective solution is PCB modeling and simulation. When simulation is used i... » read more

Blog Review: Feb. 10
By Jesse Allen - 10 Feb, 2021 - Comments: 0

Cadence's Paul McLellan finds out some of the pressing technological challenges and opportunities at the recent SEMI Industry Strategy Symposium, from the purity of gases and other materials used in semiconductor manufacturing to increasing cost and time-to-market pressures. Siemens EDA's Harry Foster examines trends in low power ASIC and IC design, including active management of power and t... » read more

Longer Chip Lifecycles Increase Security Threat
By Ed Sperling - 04 Feb, 2021 - Comments: 0

The longer chips and electronic systems remain in use, the more they will need to be refreshed with software and firmware updates. That creates a whole new level of security risks, ranging from over-the-air intercepts to compromised supply chains. These problems have been escalating as more devices are connected to the Internet and to each other, but it's particularly worrisome when it invol... » read more

Blog Review: Feb. 3
By Jesse Allen - 03 Feb, 2021 - Comments: 0

Cadence's Paul McLellan listens in on the outlook from SEMI's recent Industry Strategy Symposium, which looked at the prospects for global recovery, the application areas where growth is expected, and how segments have recently performed. Siemens EDA's Harry Foster takes a look at trends in the adoption of languages and libraries for IC and ASIC designs and finds continued interest in System... » read more

Week In Review: Design, Low Power
By Jesse Allen - 29 Jan, 2021 - Comments: 0

The CXL Consortium published the Compute Express Link 2.0 specification. CXL is an interconnect that maintains memory coherency between the CPU memory space and memory on attached devices. CXL 2.0 adds support for switching for fan-out to connect to more devices, memory pooling for increased memory utilization efficiency and providing memory capacity on demand, and support for persistent memory... » read more

Roaring ’20s For The Chip Industry
By Brian Bailey - 28 Jan, 2021 - Comments: 0

2020 was a good year for the semiconductor industry and the EDA industry that fuels it, but 2021 has the opportunity to be even better. New end application markets continue to open, and what were once seen as technical hurdles are leading to a multitude of innovative solutions, all of which need suitable tooling. No company can afford to invest everywhere, and so for EDA companies, their rel... » read more

Week In Review: Design, Low Power
By Jesse Allen - 22 Jan, 2021 - Comments: 0

Cadence will acquire NUMECA International, a provider of computational fluid dynamics (CFD), mesh generation, multi-physics simulation, and optimization solutions for industries including aerospace, automotive, industrial, and marine. “Next-generation products and systems require comprehensive multi-physics engineering solutions encompassing IP, semiconductors, IC packaging, modules, board... » read more

48V Applications Drive Power IC Package Options
By Bill Schweber - 21 Jan, 2021 - Comments: 1

The manufacturing process and die get most of the attention, but the packaging plays an important part in enabling and limiting performance, manufacturability, particularly when it comes to reliability of power devices. Given the wide range of underlying semiconductor power-device technologies — “basic” silicon, wide-bandgap silicon carbide (SiC) and gallium nitride (GaN), power levels... » read more

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