tag: ANSYS

Blog Review: Nov. 11
By Jesse Allen - 11 Nov, 2020 - Comments: 0

Mentor's Chris Spear proposes mixing together the compactness of the field macro style with the preciseness of the do methods when writing a UVM transaction class. Cadence's Paul McLellan looks back at the history of EPROM, some of the difficulty with actually erasing it, and the subsequent development of EEPROM. Synopsys' Tuomo Untinen explains three WPA2 authentication vulnerabilities r... » read more

Chip-Package Co-Analysis Using Ansys RedHawk-CPA
By Ansys - 11 Nov, 2020 - Comments: 0

Ansys RedHawk-CPA is an integrated chip–package co-analysis solution that enables quick and accurate modeling of the package layout for inclusion in on-chip power integrity simulations using Ansys RedHawk. With RedHawk-CPA a designer can perform static IR drop analysis and AC hotspot analysis of the package layout following RedHawk static and dynamic analyses respectively. To ensure a reliab... » read more

Week In Review: Design, Low Power
By Jesse Allen - 06 Nov, 2020 - Comments: 0

Tools Mentor unveiled Tessent Streaming Scan Network software for its Tessent TestKompress software. The new solution includes embedded infrastructure and automation that decouples core-level DFT requirements from the chip-level test delivery resources for a simplified bottom-up DFT flow. The bus-based scan data distribution architecture enables simultaneous testing of any number of cores and ... » read more

Blog Review: Nov. 4
By Jesse Allen - 04 Nov, 2020 - Comments: 0

Arm's Joshua Sowerby points to how to improve machine learning performance on mobile devices by using smart pruning to remove convolution filters from a network, reducing its size, complexity, and memory footprint. Mentor's Neil Johnson checks out how designers can write and verify RTL real-time using formal property checking in the style of test-driven development and why to give it a try. ... » read more

Security Tradeoffs In Chips And AI Systems
By Ed Sperling - 03 Nov, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss the cost and effectiveness of security in chip architectures and AI systems with with Vic Kulkarni, vice president and chief strategist at Ansys; Jason Oberg, CTO and co-founder of Tortuga Logic; Pamela Norton, CEO and founder of Borsetta; Ron Perez, fellow and technical lead for security architecture at Intel; and Tim Whitfield, vice president of s... » read more

Week In Review: Design, Low Power
By Jesse Allen - 30 Oct, 2020 - Comments: 0

M&A AMD will acquire Xilinx for $35 billion in an all-stock deal. "Joining together with AMD will help accelerate growth in our data center business and enable us to pursue a broader customer base across more markets,” said Victor Peng, Xilinx president and CEO. The deal is expected to close by the end of 2021. The acquisition of the programmable logic giant will leave only a few purepla... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 30 Oct, 2020 - Comments: 0

Automotive Synopsys added support for Infineon's automotive AI chip, the AURIX TC4xx 32-bit microcontroller with parallel processing unit. Dialog Semiconductor announced automotive qualification for its DA7280 high-definition haptic driver. The company Alps Alpine is using the DA7280 in Alps Alpine Heavy, the latest version of its HAPTIC Reactor Linear Resonant Actuators (LRAs). Bosch, M... » read more

A Renaissance For Semiconductors
By Brian Bailey - 29 Oct, 2020 - Comments: 2

Major shifts in semiconductors and end markets are driving what some are calling a renaissance in technology, but navigating this new, multi-faceted set of requirements may cause some structural changes for the chip industry as it becomes more difficult for a single company to do everything. For the past decade, the mobile phone industry has been the dominant driver for the semiconductor eco... » read more

Blog Review: Oct. 28
By Jesse Allen - 28 Oct, 2020 - Comments: 0

Synopsys' Jacob Wilson provides some tips for how to prepare for the upcoming ISO SAE 21434 cybersecurity standard for road vehicles, starting with a security plan and understanding of risk levels. Cadence's Paul McLellan checks out Arm's first face-to-face wafer-bonded design, why it might be desirable, and some important aspects of how the proof-of-concept was developed. In a video, Men... » read more

Performance and Power Tradeoffs At 7/5nm
By Ed Sperling - 27 Oct, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss power optimization with Oliver King, CTO at Moortec; João Geada, chief technologist at Ansys; Dino Toffolon, senior vice president of engineering at Synopsys; Bryan Bowyer, director of engineering at Mentor, a Siemens Business; Kiran Burli, senior director of marketing for Arm's Physical Design Group; Kam Kittrell, senior product management group d... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy