Where Timing And Voltage Intersect


João Geada, chief technologist at ANSYS, talks about the limitations for power delivery networks and what processors can handle, why the current solutions to these issues are causing failures, and how voltage reduction can affect timing. » read more

Reducing Power At RTL


Power management and reduction at the register transfer level is becoming more problematic as more heterogeneous elements are added into advanced designs and more components are dependent on interactions with other components. This has been a growing problem in leading-edge designs for the past couple of process nodes, but similar issues have begun creeping into less-sophisticated designs as... » read more

The Four Benefits of Simulation-Driven Design


Simulation-driven design involves using simulation early, often, and throughout the design cycle to make better informed decisions, explore more alternatives and verify performance. This report presents the business benefits of taking a simulation-driven design approach, enabled by engineers, across the design cycle. It focuses on the four core sources of value for simulation-driven design: inc... » read more

Blog Review: Feb. 5


Cadence's Paul McLellan checks out the different ways persistent memories can be used, as well as a basic persistent programming model and key things hardware needs to support. In a video, Mentor's Colin Walls explains what's different about operating systems for embedded applications and how to go about selecting one. Synopsys' Taylor Armerding finds troubling vulnerabilities in U.S. cri... » read more

Week In Review: Manufacturing, Test


Coronavirus The coronavirus in China has been declared as a global health emergency by the World Health Organization (WHO). The situation appears to be much worse than SARS (severe acute respiratory syndrome), which hit in 2003. Several companies are taking precautionary measures to prevent widespread transmission of coronavirus. For example, ASE has devoted a Web page for the measures it is t... » read more

Week In Review: Design, Low Power


Flex Logix uncorked a new EFLX 1K eFPGA core optimized for the needs of customers on TSMC 40nm Ultra Low Power (ULP) and 40nm Low Power (LP) process technologies. It targets customers focused on low cost and power management. Using a cut-down version and the same software of the EFLX 4K, the EFLX 1K Logic core has 368 inputs and 368 outputs with 900 LUT4 equivalent logic capacity. The EFLX 1K D... » read more

Big Design, IP and End Market Shifts In 2020


EDA is on a roll. Design starts are up significantly thanks to increased investment in areas such as AI, a plethora of new communications standards, buildout of the Cloud, the race toward autonomous driving and continued advancements in mobile phones. Many designs demand the latest technologies and push the limits of complexity. Low power is becoming more than just reducing wasted power at t... » read more

Blog Review: Jan. 29


Mentor's Shivani Joshi introduces the basics of PCB layout and the importance of being familiar with a manufacturer's specs. Cadence's Paul McLellan takes a look at why Design Technology Co-Optimization is increasingly necessary as 3nm approaches and new transistor types like CFET and gate-all-around are on the horizon. Synopsys' Sai Karthik Madabhushi recounts an alarming incident that h... » read more

Blog Review: Jan. 22


Synopsys' Taylor Armerding explains different types of social engineering scams that target everyone from CEOs to gamers to smart appliance users, and what training and tools can better protect people and their organizations. Mentor's Dennis Joseph points to some important things to consider if you're thinking about switching from GDS to OASIS and some tips for converting files. Cadence's... » read more

Using Digital Image Correlation To Determine BGA Warpage


Digital image correlation (DIC) is a non-contact, full-field displacement, optical measurement technique. It is often used in the following applications: Material characterization Coefficient of thermal expansion (CTE) Glass transition temperature Young’s modulus Poisson’s ratio Sample testing for fatigue and failure In situ monitoring of displacements and str... » read more

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