The Criticality Of The E/E Architecture

By Mentor, a Siemens Business - 04 Mar, 2020 - Comments: 0

Modern vehicles are highly sophisticated systems incorporating electrical, electronic, software and mechanical components. Mechanical systems are giving way to advanced software and electronic devices, driving automakers to innovate and differentiate their vehicles via the electric and electronic (E/E) architecture. Future architectures need to be scalable across vehicle platforms, flexible to ... » read more

Automotive Chip Design Workflow

By Ed Sperling - 17 Feb, 2020 - Comments: 0

Stewart Williams, senior technical marketing manager at Synopsys, talks about the consolidation of chips in a vehicle and the impact of 7/5nm on automotive SoC design, how to trade off power, performance, area and reliability, and how ISO 26262 impacts those variables. » read more

Software In Inference Accelerators

By Ed Sperling - 10 Feb, 2020 - Comments: 0

Geoff Tate, CEO of Flex Logix, talks about the importance of hardware-software co-design for inference accelerators, how that affects performance and power, and what new approaches chipmakers are taking to bring AI chips to market. » read more

Survival Of The Cheapest?

By Brian Bailey - 26 Sep, 2019 - Comments: 0

We all want the best solution to win, but that rarely happens. History is littered with products that were superior to the alternatives and yet lost out to a lessor rival. I am sure several examples are going through your mind without me having to list them. It is normally the first to volume that wins, often accelerated by copious amounts of marketing dollar to help push it against headwinds. ... » read more

Chiplets, Faster Interconnects, More Efficiency

By Ed Sperling - 22 Aug, 2019 - Comments: 1

Big chipmakers are turning to architectural improvements such as chiplets, faster throughput both on-chip and off-chip, and concentrating more work per operation or cycle, in order to ramp up processing speeds and efficiency. Taken as a whole, this represents a significant shift in direction for the major chip companies. All of them are wrestling with massive increases in processing demands ... » read more

The Automation Of AI

By Brian Bailey - 28 Mar, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss the role that EDA has in automating artificial intelligence and machine learning with Doug Letcher, president and CEO of Metrics; Daniel Hansson, CEO of Verifyter; Harry Foster, chief scientist verification for Mentor, a Siemens Business; Larry Melling, product management director for Cadence; Manish Pandey, Synopsys fellow; and Raik Brinkmann, CEO ... » read more

Designing An AI SoC

By Ed Sperling - 11 Mar, 2019 - Comments: 0

Susheel Tadikonda, vice president of networking and storage at Synopsys, looks at how to achieve economies of scale in AI chips and where the common elements are across all the different architectures. https://youtu.be/fm0kxnj3DuM » read more

Using Memory Differently

By Ann Mutschler - 31 Jan, 2019 - Comments: 0

Chip architects are beginning to rewrite the rules on how to choose, configure and use different types of memory, particularly for chips with AI and some advanced SoCs. Chipmakers now have a number of options and tradeoffs to consider when choosing memories, based on factors such as the application and the characteristics of the memory workload, because different memory types work better tha... » read more

Concurrent Test

By Ed Sperling - 11 Jan, 2019 - Comments: 0

Derek Wu, senior staff applications engineer at Advantest, looks at the need for doing multiple tests at the same time as chip designs become more complex, increasingly heterogeneous, and much more difficult to test at advanced nodes. https://youtu.be/-8inbjX_af0 __________________________________ See more tech talk videos here. » read more

Inferencing In Hardware

By Ed Sperling - 06 Dec, 2018 - Comments: 0

Cheng Wang, senior vice president of engineering at Flex Logix, examines shifting neural network models, how many multiply-accumulates are needed for different applications, and why programmable neural inferencing will be required for years to come. https://youtu.be/jb7qYU2nhoo See other tech talk videos here. » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: architecture