Improving Reliability In Automobiles

By John Koon - 14 Nov, 2022 - Comments: 0

Carmakers are turning to predictive and preventive maintenance to improve the safety and reliability of increasingly electrified vehicles, setting the stage for more internal and external sensors, and more intelligence to interpret and react to the data generated by those sensors. The number of chips inside of vehicles has been steadily rising, regardless of whether they are powered by elect... » read more

Week In Review: Semiconductor Manufacturing, Test

By Karen Heyman - 11 Nov, 2022 - Comments: 0

U.S. President Joe Biden appears ready to increase pressure on Japan and the Netherlands to help block the flow of advanced chip technology to China, where it can be used to develop cutting-edge weapons. "You will see Japan and Netherlands follow our lead," U.S. Commerce Secretary Gina Raimondo told CNBC. Japan plans to budget ¥350 billion ($2.38 billion) in a research collaboration with th... » read more

Week In Review: Auto, Security, Pervasive Computing

By Marie C. Baca - 11 Nov, 2022 - Comments: 0

Automotive And Mobility Two major auto OEMs revealed new electric vehicle models this week. The Audi Q8 e-tron has 40 driver assistance systems including five radar sensors, five cameras, and 12 ultrasonic sensors, and comes with either an 89 net kilowatt-hour battery or a 106 net kilowatt-hour battery. It arrives in the U.S. in April 2023. The Volvo EX90 contains both lidar and 5G connectivit... » read more

Week In Review: Design, Low Power

By Jesse Allen - 11 Nov, 2022 - Comments: 0

Chip design Fraunhofer IIS/EAS implemented the Bunch of Wires (BoW) standard-based interface IP from the Open Compute Project (OCP) on Samsung's 5nm technology. The effort is intended to make chiplets more feasible for products with small and medium-sized production runs and determine the need for additional uniform standards in the future, such as for die-to-die bonding. “As part of t... » read more

Taking Power Much More Seriously

By Brian Bailey - 10 Nov, 2022 - Comments: 0

An increasing number of electronic systems are becoming limited by thermal issues, and the only way to solve them is by elevating energy consumption to a primary design concern rather than a last-minute optimization technique. The optimization of any system involves a complex balance of static and dynamic techniques. The goal is to achieve maximum functionality and performance in the smalles... » read more

Solving Thermal Coupling Issues In Complex Chips

By Ann Mutschler - 10 Nov, 2022 - Comments: 0

Rising chip and packaging complexity is causing a proportionate increase in thermal couplings, which can reduce performance, shorten the lifespan of chips, and impact overall reliability of chips and systems. Thermal coupling is essentially a junction between two devices, such as a chip and a package, or a transistor and a substrate, in which heat is transferred from one to the other. If not... » read more

Developers Embrace Standards To Accelerate Growth Opportunities For The IoT

By Paul Williamson - 10 Nov, 2022 - Comments: 0

By the end of the decade, the potential economic value of the Internet of Things (IoT) is expected to reach $12.6 trillion (yes, that’s a ‘t,’ not a typo), according to a McKinsey study. To achieve the scale required to meet this opportunity, critical IoT standards are coming together to enable the frictionless deployment of secure endpoint-to-cloud solutions – and being embraced by th... » read more

Balancing Power And Heat In Advanced Chip Designs

By Karen Heyman - 10 Nov, 2022 - Comments: 1

Power and heat use to be someone else's problem. That's no longer the case, and the issues are spreading as more designs migrate to more advanced process nodes and different types of advanced packaging. There are a number of reasons for this shift. To begin with, there are shrinking wire diameters, thinner dielectrics, and thinner substrates. The scaling of wires requires more energy to driv... » read more

Blog Review: Nov. 9

By Jesse Allen - 09 Nov, 2022 - Comments: 0

Cadence's Claire Ying finds that the latest update to CXL, which introduced memory-centric fabric architectures and expanded capabilities for improving scale and optimizing resource utilization, could change how some of the world’s largest data centers and fastest supercomputers are built. Synopsys' Gervais Fong and Morten Christiansen examine the latest updates in the USB 80Gbps specifica... » read more

Innovate By Customized Instructions, But Without Fragmenting The Ecosystem

By Arm - 09 Nov, 2022 - Comments: 0

This white paper reviews the design considerations for SoC designers when they deploy their hardware accelerators, and how software developers access the accelerators implemented using Arm Custom Instructions. Click here to read more. » read more

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Knowledge Centers
Entities, people and technologies explored

Intel Vs. Samsung Vs. TSMC

Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.

by Ed Sperling

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Chip Industry Week In Review

Softbank's acquisition; advanced packaging funding; glass substrates; engineered copper wire; semi equipment set new record; HBM4; AI chips rake in funding; X-ray inspection; apprenticeships.

by The SE Staff

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

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