Blog Review: Nov. 27

By Jesse Allen - 27 Nov, 2019 - Comments: 0

Arm's Ben Fletcher digs into what's needed to make wireless 3D integration a reality from a tool to automate the design and optimization process for inductors used in wireless 3D-ICs to exploring how the data can be encoded in the transceiver to reduce power consumption. Cadence's Paul McLellan listens in as Eli Singerman of Intel explains the importance of platform security and why firmware... » read more

Using PCIe Real World Interface For High-Speed Hybrid Prototyping

By Synopsys - 25 Nov, 2019 - Comments: 0

This white paper highlights a novel approach to hybrid prototyping using a PCIe interface between the HAPS FPGA-based prototyping and the Virtualizer virtual prototyping. The use of PCIe real world interface helps to deliver a prototyping system, running fast enough to enable embedded software development and hardware-software co-validation in the shortest possible time. The hybrid prototyping ... » read more

Week In Review: IoT, Security, Automotive

By Susan Rambo - 22 Nov, 2019 - Comments: 0

Automotive Porsche’s electric race car, the 99X Electric, used ANSYS Technology’s system-level simulation solutions to create an advanced electric powertrain. The powertrain is also being adapted for use in Porsche’s consumer electric cars. "ANSYS system-level simulations are instrumental for optimizing the Porsche E-Performance Powertrain's motor, gearbox, power electronics and control ... » read more

Blog Review: Nov. 20

By Jesse Allen - 20 Nov, 2019 - Comments: 0

Arm's Ben Fletcher points to research into a new low-cost alternative to through-silicon vias in 3D stacked ICs, particularly cost-sensitive IoT designs, where communication between silicon layers is completely wireless. Cadence's Paul McLellan checks in on the progress of DARPA's OpenROAD project to build a no-human-in-the-loop open source EDA flow for leading-edge nodes. Mentor's Colin ... » read more

Making Sense Of Inferencing Options

By Ed Sperling - 19 Nov, 2019 - Comments: 0

Ian Bratt, fellow in Arm’s machine learning group, sheds light on all the different processing elements in machine learning, how different end user requirements affect those choices, why CPUs are a critical element in orchestrating what happens in these systems, and how power and software play into these choices. » read more

Scalable Platforms For Evolving AI

By Steve Roddy - 14 Nov, 2019 - Comments: 0

Wear and tear on big, heavy vehicles such as trains can cause unexpected delays and repairs, not to mention create safety hazards that can go unnoticed for months until they become critical. In the past, maintenance teams personally examined the undercarriage of a locomotive to look for stress cracks and other anomalies. Later, imaging and sonar technologies were introduced to find what the hum... » read more

Building Quantum Espresso With Arm Compiler

By Arm - 14 Nov, 2019 - Comments: 0

This resource topic addresses how to build Quantum Espresso with Arm Compiler for HPC. Quantum Espresso is an integrated suite of open-source computer codes for electronic-structure calculations and materials modeling at the nanoscale. It is based on density-functional theory, plane waves, and pseudopotentials. Click here to read more. » read more

Speeding Up 3D Design

By Brian Bailey - 14 Nov, 2019 - Comments: 0

2.5D and 3D designs have garnered a lot of attention recently, but when should these solutions be considered and what are the dangers associated with them? Each new packaging option trades off one set of constraints and problems for a different set, and in some cases the gains may not be worth it. For other applications, they have no choice. The tooling in place today makes it possible to de... » read more

Power Complexity On The Rise

By Ann Mutschler - 14 Nov, 2019 - Comments: 0

New chip architectures and custom applications are adding significant challenges to chip design and verification, and the problems are becoming much more complex as low power is added into the mix. Power always has been a consideration in design, but in the past it typically involved different power domains that were either on, off, or in some level of sleep mode. As hardware architectures s... » read more

Addressing Pain Points In Chip Design

By Ed Sperling - 13 Nov, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss the impact of multi-physics and new market applications on chip design with John Lee, general manager and vice president of ANSYS' Semiconductor Business Unit; Simon Burke, distinguished engineer at Xilinx, Duane Boning, professor of electrical engineering and computer science at MIT; and Thomas Harms, director EDA/IP Alliance at Infineon. What foll... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?