2024 Set The Stage For NoC Interconnect Innovations In SoC Design


What a year it’s been for Arteris! Reflecting on 2024, the company achieved exciting milestones and breakthroughs that pushed the boundaries of system-on-chip (SoC) design. A game-changing new technology was unveiled, a major product was launched, and existing solutions were tailored for AI, automotive, high-performance computing (HPC) and more. Along the way, we welcomed new partners and ... » read more

RISC-V Profiles Help Conformance


Experts At The Table: What's needed to be able to trust that a RISC-V implementation will work as expected across multiple designs using standard OSes. Semiconductor Engineering discussed the issue with John Min, vice president of customer service at Arteris; Zdeněk Přikryl, CTO of Codasip; Neil Hand, director of marketing at Siemens EDA (at the time of this discussion); Frank Schirrmeist... » read more

Where Is The Software For Shift Left?


Co-development of hardware and software has been a dream for a long time, but significant hurdles remain. Neither domain is ready with what the other requires at the appropriate time. The earlier something can be done in a development flow, the less likely problems will be found when they are more difficult or expensive to fix. It may require both tool and methodology changes, so that a proc... » read more

Chip Industry Week In Review


Global chips sales hit a record $56.9 billion in October, a 22% increase versus October 2023, according to the Semiconductor Industry Association. Also, global semiconductor equipment billings reached $30.38 billion in Q3 2024, a 19% YoY increase and 13% growth QoQ, SEMI reported. TSMC commenced equipment installation for its 2nm fab in Kaohsiung, Taiwan, six months ahead of schedule. The 2n... » read more

Scaling AI Chip Design With NoC Soft Tiling


Tiling is about repeating modular units within the same chip to enhance scalability and efficiency; chiplets involve combining different silicon pieces to achieve a more diverse and powerful system within a single package. Network-on-chip (NoC) soft tiling is complimentary but distinct from chiplets described above as it repeats modular units inside a NoC design. Soft tiling within a NoC off... » read more

Top-Down Vs. Bottom-Up Chiplet Design


Chiplets are gaining widespread attention across the semiconductor industry, but for this approach to really take off commercially it will require more standards, better modeling technologies and methodologies, and a hefty amount of investment and experimentation. The case for chiplets is well understood. They can speed up time to market with consistent results, at whatever process node work... » read more

Chip Industry Week In Review


SK hynix started mass production of 1-terabit  321-high NAND, with availability scheduled for the first half of next year. Rapidus will receive an additional ¥200 billion yen ($1.28B) from the Japanese government beginning in fiscal year 2025, reports Nikkei. This is on top of ¥920 billion yen ($5.98B) Rapidus has already received from the government in support of its goal to reach commer... » read more

Chip Industry Week In Review


CSIS issued a new report that says Intel is "not too big to fail, but too good to lose." The report noted that Intel is needed for national security, and that it must be viewed in a geopolitical context rather than from a purely business standpoint when it comes to funding the company. Japan's government is creating a 10 trillion yen (~$65 billion) fund for next-gen technologies, including A... » read more

Shift Left Is The Tip Of The Iceberg


Shift left is evolving from a buzzword into a much broader shift in design methodology and EDA tooling, and while it's still early innings there is widespread agreement that it will be transformative. The semiconductor industry has gone through many changes over the past few decades. Some are obvious, but others happen because of a convergence of multiple factors that require systemic change... » read more

RISC-V’s Software Portability Challenge


Experts At The Table: RISC-V provides a platform for customization, but verifying those changes remains challenging. Semiconductor Engineering discussed the issue with John Min, vice president of customer service at Arteris; Zdeněk Přikryl, CTO of Codasip; Neil Hand, director of marketing at Siemens EDA (at the time of this discussion); Frank Schirrmeister, executive director for strategi... » read more

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