Chip Industry Week in Review

By The SE Staff - 02 May, 2025 - Comments: 0

Check out the Inside Chips podcast for our behind-the-scenes analysis of changes at Intel Foundry. Intel rolled out its updated process technology roadmap this week, along with early process design kit (PDK) for its 14A gate-all-around process technology. That node will utilize high-NA EUV, and include direct contact power delivery, the second generation of its backside power delivery techno... » read more

Chip Industry Week in Review

By The SE Staff - 25 Apr, 2025 - Comments: 0

To listen to the podcast version, click here. TSMC unveiled an unusually detailed roadmap at this week's North America Technology Symposium, including future architectures for 3D-ICs for high-performance computing and small, extremely low-power chips for AR/VR glasses, and two implementations of system-on-wafer. Fig. 1: TSMC's future packaging and stacking roadmap. Source: TSMC The ... » read more

Data Movement Is the Energy Bottleneck of Today’s SoCs

By Andy Nightingale - 24 Apr, 2025 - Comments: 0

In today’s AI-focused semiconductor landscape, raw compute performance alone no longer defines the effectiveness of a system-on-chip (SoC). The efficiency of data movement across the chip has become just as important. Whether designed for data centers or edge AI devices, SoCs must now prioritize data transport as a core architectural consideration. Moving data efficiently across the silicon f... » read more

AI Drives Re-Engineering Of Nearly Everything In Chips

By Ed Sperling - 24 Apr, 2025 - Comments: 0

AI's ability to mine patterns across massive quantities of data is causing fundamental changes in how chips are used, how they are designed, and how they are packaged and built. These shifts are especially apparent in high-performance AI architectures being used inside of large data centers, where chiplets are being deployed to process, move, and store massive amounts of data. But they also ... » read more

Combination of Coherent and Non-Coherent NoCs Facilitates Cutting-Edge SoC Design

By Arteris - 23 Apr, 2025 - Comments: 0

SCALINX, a fabless semiconductor company specializing in the design of system-on-chip (SoC) devices, was looking to develop a large, next-generation SoC integrating analog, digital, mixed-signal, and RF functionality. Business Challenge • Develop a large, next-generation SoC integrating analog, digital, mixed-signal, and RF functionality. Design Challenges • Ensure different portions ... » read more

Chip Industry Week In Review

By The SE Staff - 04 Apr, 2025 - Comments: 0

Check out our new Inside Chips podcast. President Trump’s ‘Liberation Day’ tariffs were announced this week. The executive order stated that semiconductors and copper imports are not directly subject to the reciprocal tariff, although the exemption may be short-lived. Semiconductor equipment and tools were not mentioned, leaving the industry searching for clarification. Regardless, hig... » read more

Challenges In Managing Chiplet Resources

By Ann Mutschler - 27 Mar, 2025 - Comments: 0

Managing chiplet resources is emerging as a significant and multi-faceted challenge as chiplets expand beyond the proprietary designs of large chipmakers and interact with other elements in a package or system. Poor resource management in chiplets adds an entirely new dimension to the usual power, performance, and area tradeoffs. It can lead to performance bottlenecks, because as chiplets co... » read more

Achieving Lower Power, Better Performance, And Optimized Wire Length In Advanced SoC Designs

By Andy Nightingale - 27 Mar, 2025 - Comments: 0

In system-on-chip (SoC) design, wire length refers to the total physical distance of interconnects within a network-on-chip (NoC). It is a critical parameter that influences performance, power consumption, and manufacturing costs. Today’s SoCs incorporate numerous IP blocks connected by multiple complex NoCs and require efficient management of wire lengths. Excessive wire length increases lat... » read more

Accelerate And Derisk RISC-V- Based SoC Designs

By Arteris - 26 Mar, 2025 - Comments: 0

How to accelerate and derisk RISC-V-based SoC designs using silicon-proven network-on-chip IP and SoC integration automation software. This technology seamlessly connects any IP from multiple vendors and shortens design cycles and time to revenue. Maximize overall efficiency for the best product design, leveraging the best NoC IP and expert support. Read more here. » read more

The Evolving Role Of AI In Verification

By Ann Mutschler - 26 Mar, 2025 - Comments: 0

Experts At The Table: The pressure on verification engineers to ensure the functional correctness of devices has increased exponentially as chips have gotten more complex and evolved into SoC, 3D-ICs, multi-die chiplets and beyond. Semiconductor Engineering sat down with a panel of experts, which included Josh Rensch, director of application engineering at Arteris; Matt Graham, senior group dir... » read more

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tag: Arteris

Chip Industry Week in Review

Chip Industry Week in Review

Data Movement Is the Energy Bottleneck of Today’s SoCs

AI Drives Re-Engineering Of Nearly Everything In Chips

Combination of Coherent and Non-Coherent NoCs Facilitates Cutting-Edge SoC Design

Chip Industry Week In Review

Challenges In Managing Chiplet Resources

Achieving Lower Power, Better Performance, And Optimized Wire Length In Advanced SoC Designs

Accelerate And Derisk RISC-V- Based SoC Designs

The Evolving Role Of AI In Verification

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