An Entangled Heterarchy

By Brian Bailey - 09 Nov, 2023 - Comments: 1

For decades, a form of structural hierarchy has been the principal means of handling complexity in chip design. It's not always perfect, and there is no ideal way in which to divide and conquer because that would need to focus on the analysis being performed. In fact, most systems can be viewed from a variety of different hierarchies, equally correct, and together forming a heterarchy. The e... » read more

Chip Industry Week In Review

By The SE Staff - 03 Nov, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, Jesse Allen, and Liz Allan President Biden issued an executive order on the “Safe, Secure, and Trustworthy Development and Use of Artificial Intelligence.” It says entities need to report large-scale computing clusters and the total computing power available, including “any model that was trained using a quantity of computing power greater than 1,026 inte... » read more

Chip Industry’s Technical Paper Roundup: October 31

By Liz Allan - 31 Oct, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=159 /] More Reading Technical Paper Library home » read more

What Will That Chip Cost?

By Brian Bailey - 30 Oct, 2023 - Comments: 1

In the past, analysts, consultants, and many other experts attempted to estimate the cost of a new chip implemented in the latest process technology. They concluded that by the 3nm node, only a few companies would be able to afford them — and by the time they got into the angstrom range, probably nobody would. Much has changed over the past few process nodes. Increasing numbers of startups... » read more

System-on-Chip Integration Complexity And Hardware/Software Contracts

By Frank Schirrmeister - 26 Oct, 2023 - Comments: 0

From the earliest days of my career, when designing chips, I have always navigated the interface between hardware and software for semiconductor design in my roles. My initial chip designs included video and audio encoding and decoding, supporting standards like MPEG and H.261. As acceleration parts of hardware/software systems, these had many Control and Status Registers (CSRs) to program. The... » read more

Rethinking Design, Workflow For 3D

By Karen Heyman - 26 Oct, 2023 - Comments: 0

In the 3D world, where NAND has hundreds of layers and packages come in intricate stacks, fresh graduates and veteran engineers alike are being confronted with design challenges that require a rethinking of both classic designs and traditional workflows, but without breaking the laws of physics. “There are pockets of things that have been on 3D for quite some time,” said Kenneth Larson, ... » read more

Making Connections In 3D Heterogeneous Integration

By Ann Mutschler - 26 Oct, 2023 - Comments: 0

Activity around 3D heterogeneous integration (3DHI) is heating up, driven by growing support from governments, the need to add more features and compute elements into systems, and a widespread recognition that there are better paths forward than packing everything into a single SoC at the same process node. The leading edge of chip design has changed dramatically over the last few years. Int... » read more

FPGA-Proven RISC-V System With Hardware Accelerated Task Scheduling

By Technical Paper Link - 24 Oct, 2023 - Comments: 0

A technical paper titled “Enabling HW-based Task Scheduling in Large Multicore Architectures” was published by researchers at Barcelona Supercomputing Center, University of Campinas, University of Sao Paulo, and Arteris Inc. Abstract: "Dynamic Task Scheduling is an enticing programming model aiming to ease the development of parallel programs with intrinsically irregular or data-dependent... » read more

Chip Industry Week In Review

By The SE Staff - 20 Oct, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, and Liz Allan SRC unfurled its Microelectronics and Advanced Packaging (MAPT) industry-wide 3D semiconductor roadmap, addressing such topics as advanced packaging, heterogeneous integration, analog and mixed-signal semiconductors, energy efficiency, security, the related foundational ecosystem, and more. The guidance is the collective effort of 300 individuals ... » read more

Chip Industry Week In Review

By The SE Staff - 13 Oct, 2023 - Comments: 0

By Liz Allan, Jesse Allen, and Karen Heyman. Canon uncorked a nanoimprint lithography system, which the company said will be useful down to about the 5nm node. Unlike traditional lithography equipment, which projects a pattern onto a resist, nanoimprint directly transfers images onto substrates using a master stamp patterned by an e-beam system. The technology has a number of limitations and... » read more

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tag: Arteris

An Entangled Heterarchy

Chip Industry Week In Review

Chip Industry’s Technical Paper Roundup: October 31

What Will That Chip Cost?

System-on-Chip Integration Complexity And Hardware/Software Contracts

Rethinking Design, Workflow For 3D

Making Connections In 3D Heterogeneous Integration

FPGA-Proven RISC-V System With Hardware Accelerated Task Scheduling

Chip Industry Week In Review

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