tag: ASE

Week In Review: Manufacturing, Test
By Mark LaPedus - 01 Feb, 2019 - Comments: 0

Chipmakers and OEMs Taiwan specialty foundry vendor Vanguard International Semiconductor (VIS) will acquire GlobalFoundries’ Fab 3E facility in Singapore for $236 million. Fab 3E manages a monthly capacity of approximately 35,000 200mm wafers. The transaction includes buildings, facilities, and equipment, as well as IP associated with GF’s MEMS business. VIS currently has three 200mm fa... » read more

More 2.5D/3D, Fan-Out Packages Ahead
By Mark LaPedus - 15 Jan, 2019 - Comments: 0

A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year. The new packages are targeted to address many of the same and challenging applications in the market, such as multi-die integration, memory bandwidth issues and even chip scaling. But the new, advanced IC packages face some technical challenges. And cost remains an issue as advan... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 11 Jan, 2019 - Comments: 0

Trade and fab equipment The SEMI Industry Strategy Symposium (ISS) this week opened with the theme “Golden Age of Semiconductor: Enabling the Next Industrial Revolution.” The annual three-day conference gave the year’s first outlook of the global electronics manufacturing industry. Click here for a recap. SEMI and Imec are joining forces to drive innovation and deepen industry align... » read more

Reducing Advanced Packaging Costs
By Ed Sperling - 09 Jan, 2019 - Comments: 0

Semiconductor Engineering sat down with Chenglin Liu, director of package engineering at Marvell; John Hunt, senior director of engineering at ASE; Eric Tosaya, senior director of package manufacturing at eSilicon; and Juan Rey, vice president of engineering for Calibre at Mentor, a Siemens Business. What follows are excerpts of that discussion, which was held in front of a live audience at MEP... » read more

Packaging Biz Faces Challenges in 2019
By Mark LaPedus - 10 Dec, 2018 - Comments: 0

The IC packaging industry is bracing for slower growth, if not uncertainty, in 2019, even though advanced packaging remains a bright spot in the market. Generally, IC packaging houses saw strong demand in the first part of 2018, but the market cooled in the second half of the year due to a slowdown in memory. Going forward, the slower IC packaging market is expected to extend into the first ... » read more

Where Advanced Packaging Makes Sense
By Ed Sperling - 10 Dec, 2018 - Comments: 0

Semiconductor Engineering sat down with Chenglin Liu, director of package engineering at Marvell; John Hunt, senior director of engineering at ASE; Eric Tosaya, senior director of package manufacturing at eSilicon; and Juan Rey, vice president of engineering for Calibre at Mentor, a Siemens Business. What follows are excerpts of that discussion, which was held in front of a live audience at MEP... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 30 Nov, 2018 - Comments: 0

Chipmakers GlobalFoundries has announced that its advanced silicon-germanium (SiGe) offering is available for prototyping on 300mm wafers. GF’s SiGe technology has been shipping on its 200mm production line in Burlington, Vt. The technology, a 90nm SiGe process, is moving to 300mm wafers at GF’s Fab 10 facility in East Fishkill, N.Y. The SiGe technology is called 9HP. “The increasing ... » read more

Getting Down To Business On Chiplets
By Ed Sperling - 26 Nov, 2018 - Comments: 0

Government agencies, industry groups and individual companies are beginning to rally around various chiplet models, setting the stage for complex chips that are quicker and cheaper to build using standardized interfaces and components. The idea of putting together different modules like LEGOs has been talked about for the better part of a decade. So far, only Marvell has used this concept co... » read more

Panel Fan-out Ramps, Challenges Remain
By Mark LaPedus - 05 Nov, 2018 - Comments: 0

After years of R&D, panel-level fan-out packaging is finally beginning to ramp up in the market, at least in limited volumes for a few vendors. However, panel-level fan-out, which is an advanced form of today’s fan-out packaging, still faces several technical and cost challenges to bring this technology into the mainstream or high-volume manufacturing. Moreover, several companies are d... » read more

Defect Challenges Growing In Advanced Packaging
By Mark LaPedus - 08 Oct, 2018 - Comments: 0

The current defect inspection systems for packaging are running out of steam for the latest advanced packages, prompting the need for new tools in the market. In response, several vendors are rolling out new defect inspection systems for use in various advanced packages, such as 2.5D/3D technologies and fan-out. The new defect inspection systems are more capable than the previous tools, but ... » read more

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