Better Analytics Needed For Assembly


Package equipment sensors, newer inspection techniques, and analytics enable quality and yield improvement, but all of those will require a bigger investment on the part of assembly houses. That's easier said than done. Assembly operations long have operated on thin profit margins because their tasks were considered easy to manage. Much has changed over the past several years, however. The r... » read more

Tech Talk: Smart Manufacturing


Tom Salmon, vice president of collaborative technology platforms at SEMI, examines the electronics supply chain and what the industry organization is doing to pull all of the pieces together. https://youtu.be/jWX9mayMaZo Related Stories Smart Manufacturing Gains Momentum Problems remain for legacy infrastructure, but adoption will continue to grow as gaps are identified and plugged. ... » read more

Ultra-Thin Substrate Assembly Challenges For Advanced Flip Chip Package


Advanced semiconductor packaging requirements for higher and faster performance in a thinner and smaller form factor continues to grow for mobile, network and consumer devices. While the increase in device input/output (I/O) count is driven by the famous “Moore’s Law”, the packaging industry is experiencing opposing trends for more complex packaging solutions while the expected cost targe... » read more

Stacked Die Changes


Semiconductor Engineering sat down to discuss advanced packaging with David Pan, associate professor in the department of electrical and computer engineering at the University of Texas; Max Min, senior technical manager at [getentity id="22865" e_name="Samsung"]; John Hunt, senior director of engineering at ASE; and Sitaram Arkalgud, vice president of 3D portfolio and technologies at Invensas. ... » read more

What’s After Smartphones?


One of the unique things about the semiconductor industry is that it has fueled the digital revolution almost entirely by focusing on its core competencies of performance, power and area. There are few, if any, industries that can tie global growth and success to what amounts to an almost isolationist business model. Salespeople have to sell those chips, of course. Marketers have to create ... » read more

Semicon West Preview: Packaging


By Paula Doe The evolving mobile device market means the packaging, assembly and test supply chain faces a growing range of alternative technologies vying for its investment dollar, everything from Google’s modular electronics with 3D printing, to more solutions for integrating varied chips in smaller packaged systems. One potentially disruptive change is the wider use of more open-source... » read more

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