Challenges And Approaches To Developing Automotive Grade 1/0 FCBGA Package Capability


Automotive Grade 1 and 0 package requirements, defined by Automotive Electronics Council (AEC) Document AEC-100, require more severe temperature cycling and high temperature storage conditions to meet harsh automotive field requirements, such as a maximum 150°C device operating temperature, 15-year reliability and zero-defect quality level. Moreover, increased integration of device functionali... » read more

Combating Counterfeit Semiconductors in the Automotive Supply Chain


The counterfeit market for semiconductors is real, sizable and growing. Industry analysts peg the current market for fake semiconductors at $75B. Counterfeit chips pose great risk to driver comfort and safety, to say nothing of the severe negative consequences they present to automaker revenues and brand. The good news is there are immediate and cost-effective measures available to secu... » read more

Automotive System Design


Burkhard Huhnke, vice president of automotive at Synopsys, looks at how to build and update chips in increasingly sophisticated vehicles, where the problem spots are, and what comes next. » read more