Adding Value With Unit Level Traceability (ULT) In Automotive Packaging

By Amkor - 20 May, 2021 - Comments: 0

Automotive product traceability has existed in one form or another for several decades. Traceability generally refers to tracking and tracing each component that comprises every subsystem in a car. Traditionally, this has been achieved with direct part marking on mechanical or electronic components, using 1D or 2D barcodes or radio-frequency identification (RFID). Since vehicle recalls are cost... » read more

Automotive IC Shortage Drags On

By Patrick Waurzyniak - 20 May, 2021 - Comments: 1

The current automotive semiconductor shortages won’t end anytime soon. When the COVID-19 pandemic hit in early 2020, it wreaked havoc on the worldwide supply chain, but it especially caught automakers flat-footed. When the auto OEMs canceled chip orders during a roughly eight-week period of plant shutdowns, they later found their supplies of critical ICs had evaporated. To make it an ev... » read more

Challenges And Approaches To Developing Automotive Grade 1/0 FCBGA Package Capability

By Amkor - 18 Nov, 2020 - Comments: 0

Automotive Grade 1 and 0 package requirements, defined by Automotive Electronics Council (AEC) Document AEC-100, require more severe temperature cycling and high temperature storage conditions to meet harsh automotive field requirements, such as a maximum 150°C device operating temperature, 15-year reliability and zero-defect quality level. Moreover, increased integration of device functionali... » read more

Combating Counterfeit Semiconductors in the Automotive Supply Chain

By Rambus - 04 Sep, 2019 - Comments: 0

The counterfeit market for semiconductors is real, sizable and growing. Industry analysts peg the current market for fake semiconductors at $75B. Counterfeit chips pose great risk to driver comfort and safety, to say nothing of the severe negative consequences they present to automaker revenues and brand. The good news is there are immediate and cost-effective measures available to secu... » read more

Automotive System Design

By Ed Sperling - 06 May, 2019 - Comments: 0

Burkhard Huhnke, vice president of automotive at Synopsys, looks at how to build and update chips in increasingly sophisticated vehicles, where the problem spots are, and what comes next. » read more

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tag: automotive chip

Adding Value With Unit Level Traceability (ULT) In Automotive Packaging

Automotive IC Shortage Drags On

Challenges And Approaches To Developing Automotive Grade 1/0 FCBGA Package Capability

Combating Counterfeit Semiconductors in the Automotive Supply Chain

Automotive System Design

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