Accelerating Chiplet-Based SoC Design For AI-Defined Vehicles


Today, we are witnessing a paradigm shift towards a more modular design approach that disaggregates SoC functions into various chiplets, each optimized for specific functionalities. Chiplets offer more modularity, which enables product scalability and customization, which is key for AI-defined vehicles, the next generation of software-defined vehicles (SDVs). Cadence’s Helium Virtual and H... » read more

The Hidden Cost Of Automotive Software Integration – A Shortcut That Changes Everything


Automotive software is developed in silos but must function as one integrated system. This organizational reality isn’t going away, and yet its consequences remain painful: late feedback, expensive debugging, and fragile, hardware-bound integration. This white paper introduces a pragmatic, scalable solution: horizontal integration with virtual electronic control units (vECUs), test automat... » read more

New Package Solutions for Automotive Optical Sensors


This article introduces the development of a new optical ball grid array (OBGA) packaging platform designed for automotive applications, with a focus on platform development and compliance with the Automotive Electronics Council (AEC) AEC-Q100 Grade 2 reliability standard. The proposed packaging solution extends beyond traditional cavity OBGA packages, which have been primarily utilized for mic... » read more

Optimization Approach For The Dispensing of Thermal Interface Material (KIT, Robert Bosch)


A new technical paper titled "TIMtrace: Coverage Path Planning for Thermal Interface Materials" was published by researchers at Karlsruhe Institute of Technology (KIT) and Robert Bosch GmbH. Abstract "Thermal Interface Materials are used to transfer heat from a semiconductor to a heatsink. They are applied along a dispense path onto the semiconductor and spread over its entire surface once ... » read more

IoT Security By Design


After years of anticipation and steady uptake, the Internet of Things (IoT) seems poised to cross over into mainstream business use. The percentage of businesses utilizing IoT technologies has risen from 13% in 2014 to approximately 25% today. Global projections indicate that the number of IoT-connected devices is expected to reach 43 billion by 2030, nearly tripling from the figures in 2018. O... » read more

Overview of Silicon Carbide Technology: Status, Challenges, Key Drivers, and Product Roadmap


Abstract: Arguably, SiC technology is the most rapidly expanding IC manufacturing technology driven mostly by the aggressive roadmap for battery electric vehicle penetration and also industrial high-voltage/high-power applications. This paper provides a comprehensive overview of the state of the art of SiC technology focusing on the challenges starting from the difficult and lengthy SiC substr... » read more

Functional Safety Insights For Today’s Automotive Industry


As cars have evolved into rolling computing platforms, vehicle safety now extends well beyond the traditional seat belt. While they still take us to the grocery store, they also integrate advanced technology, enabling the rapid fusion of multimodal data through edge devices such as sensors and actuators. Modern vehicles offer unprecedented safety, but they can contain between one to three th... » read more

A Survey Of Digital Twins and Other Prototyping Technologies for Vehicles


A new technical paper titled "Digital Twin Technologies for Vehicular Prototyping: A Survey" was published by researchers at Central Michigan University and University of Florida. Abstract "Digital Twin (DT) technology is widely regarded as one of the most promising tools for industry development, demonstrating substantial application across numerous cyber-physical systems. Gradually, this ... » read more

Can Chiplets Serve Cost-Conscious Apps?


Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue scaling performance well beyond the size limitations of a reticle. But that improvement comes with a high price tag and a lot more complexity, which so far has limited adoption. One of the main reasons for the cost increase is the need for advanced packaging when employi... » read more

Lego-Style Software For Automotive And Industrial Chiplet Systems?


Chiplets are a key topic in the semiconductor industry today, as they offer the potential to greatly increase the performance and flexibility of chips. The current focus is primarily on implementation, in particular on the architecture and the development of die-to-die interfaces that enable efficient communication between the individual chips. These technologies hold out the promise of meeting... » read more

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