Predicting And Avoiding Failures In Automotive Chips


Semiconductor Engineering sat down to discuss automotive electronics reliability with Jay Rathert, senior director of strategic collaborations at KLA; Dennis Ciplickas, vice president of advanced solutions at PDF Solutions; Uzi Baruch, vice president and general manager of the automotive business unit at OptimalPlus; Gal Carmel, general manager of proteanTecs' Automotive Division; Andre van de ... » read more

Big Challenges In Verifying Cyber-Physical Systems


Semiconductor Engineering sat down to discuss cyber-physical systems and how to verify them with Jean-Marie Brunet, senior director for the Emulation Division at Siemens EDA; Frank Schirrmeister, senior group director for solution marketing at Cadence; Maurizio Griva, R&D Manager at Reply; and Laurent Maillet-Contoz, system and architect specialist at STMicroelectronics. This discussion was... » read more

Part Average Tests For Auto ICs Not Good Enough


Part Average Testing (PAT) has long been used in automotive. For some semiconductor technologies it remains viable, while for others it is no longer good enough. Automakers are bracing for chips developed at advanced process nodes with much trepidation. Tight control of their supply chains and a reliance upon mature electronic processes so far have enabled them to increase electronic compone... » read more

Distributed Development Of IP And SoC In Compliance With Automotive ISO 26262


Automotive functional safety System-on-Chips (SoCs) for Advanced Driver Assistance Systems (ADAS) contain several complex Intellectual Property (IP) cores. The IP cores are developed as a Safety Element out of Context (SEooC), meaning the context of the end application is not fully known at delivery time. In addition, IP development might be distributed across the globe. To reduce the risk of f... » read more

Shortages, Challenges Engulf Packaging Supply Chain


A surge in demand for chips is impacting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, key components, and equipment. Spot shortages in packaging surfaced in late 2020 and have since spread to other sectors. There are now a variety of choke points in the supply chain. Wirebond and flip-chip capacity will remain tight throughout 2021... » read more

Single Chip Auto-Valet Parking System with TDA4VMID SoC


Abstract "Auto-Valet parking is a key emerging function for Advanced Driver Assistance Systems (ADAS) enhancing traditional surround view system providing more autonomy during parking scenario. Auto-Valet parking system is typically built using multiple HW components e.g. ISP, micro-controllers, FPGAs, GPU, Ethernet/PCIe switch etc. Texas Instrument’s new Jacinto7 platform is one of industry... » read more

Turning Cars Into Mobile Devices: MIPI


Everyone remembers their first car – how you could go where you wanted to go, moving faster and going longer distances – you were mobile. Yes, our cars made us mobile, but today’s cars are becoming mobile devices themselves. More than a means of transportation, cars are evolving into complete mobile devices – connecting and connected to the internet, transportation grids, and to each ot... » read more

What Do Feedback Loops For AI/ML Devices Really Show?


AI/ML is being designed into an increasing number of chips and systems these days, but predicting how they will behave once they're in the field is, at best, a good guess. Typically, verification, validation, and testing of systems is done before devices reach the market, with an increasing amount of in-field data analysis for systems where reliability is potentially mission- or safety-criti... » read more

Automotive Test Moves In-System


With the electrification of automobiles, it’s not enough to test the new electronics thoroughly at the end of the manufacturing process. Safety standards now require that tests be performed live, in the field, with contingency plans should a test fail. “We see clear demand from the automotive semiconductor supply chain for design functionality specifically aimed at in-system monitoring,�... » read more

Four Steps To Resolving Reset Domain Crossing Data-Corruption In Automotive SoCs


By Kurt Takara (Siemens EDA), Ankush Sethi (NXP), and Aniruddha Gupta (NXP) Modern automotive SoCs typically contain multiple asynchronous reset signals to ensure systematic functional recovery from unexpected situations and faults. This complex reset architecture leads to a new set of problems such as possible reset domain crossing (RDC) issues. Conventional clock domain crossing (CDC) veri... » read more

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