Heterogeneous Integration: Fertile Ground For Medical And Biotech Innovation

By Promex Industries - 18 Jan, 2023 - Comments: 0

Sensing components in medical and biotech devices often place severe restrictions on the assembly methods that can be employed, which is part of what is driving heightened demand for heterogeneous integration (HI). It is the newest frontier for the medical and biotech manufacturing services industry to contribute our own innovations by developing the processes to build these unique combinations... » read more

Heterogeneous Assembly Datasheet

By Promex Industries - 16 Dec, 2022 - Comments: 0

Medical and biotech devices often include optical, chemical, RF, and liquid elements. Some are combined with electronic devices to increase functionality or interaction with the environment. To produce these devices, multiple technologies are combined in a cost-effective way, ideally using a rapid process development cycle to minimize time to market. Combining technologies, as well as combining... » read more

Telecare Challenges: Secure, Reliable, Lower Power

By John Koon - 20 Jul, 2022 - Comments: 0

The adoption of telecare using a variety of connected digital devices is opening the door to much more rapid response to medical emergencies, as well as more consistent monitoring, but it also is adding new challenges involving connectivity, security, and power consumption. Telecare has been on the horizon for the better part of two decades, but it really began ramping with improvements in s... » read more

State-Space Model Of An Electro-Mechanical-Acoustic Contactless Energy Transfer System Based On Multiphysics Networks

By Fraunhofer IIS/EAS - 11 May, 2022 - Comments: 0

Contactless energy transfer systems are mainly divided into acoustic, inductive, capacitive and optical, in which main applications are related to biomedical, wireless chargers and sensors in metal enclosures. When solids are used as transfer media, ultrasound transducers based on piezoelectricity can be used for through-wall power transfer, which can be named as electro-mechanical-acoustic con... » read more

Miniaturized Liquid Metal-based Flexible Electrochemical Detection System on Fabric

By Technical Paper Link - 09 May, 2022 - Comments: 0

Researchers from Beihang University (Beijing), Zhejiang University, and Tsinghua University. Abstract "Integrated electrochemical sensing platforms in wearable devices have great prospects in biomedical applications. However, traditional electrochemical platforms are generally fabricated on airtight printed circuit boards, which lack sufficient flexibility, air permeability, and conformab... » read more

Power/Performance Bits: Sept. 29

By Jesse Allen - 29 Sep, 2020 - Comments: 0

Implantable transmitter Researchers from Purdue University developed a fully implantable, wirelessly powered 2.4GHz radio-frequency transmitter chip for wireless sensor nodes and biomedical devices. The team says the transmitter chip consumes the lowest amount of energy per digital bit published to date, consuming an active-mode power of 70 μW at 10 Mbps while radiating -33 dBm of power, r... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.