tag: Brewer Science

The Materials Gap
By Ed Sperling - 21 Sep, 2017 - Comments: 0

When consolidation thinned the ranks of semiconductor foundries and equipment makers, materials companies figured things were about to get better. They haven't. There are a couple of reasons for this. First, semiconductors are now so complex and difficult to develop that a slew of innovations are required on all sides. Everyone is familiar with transistor structures, interconnects and lithog... » read more

Inside Panel-Level Fan-Out Technology
By Mark LaPedus - 11 Sep, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss panel-level fan-out packaging technology with Tanja Braun, deputy group manager at the Fraunhofer Institute for Reliability and Microintegration IZM, and Michael Töpper, business development manager at Fraunhofer IZM. Braun is responsible for the Panel Level Packaging Consortium at Fraunhofer IZM, as well as the group manager for assembly and encap... » read more

Flexible Devices Drive New IoT Apps
By Jeff Dorsch - 03 Aug, 2017 - Comments: 1

Printed and flexible electronics are becoming almost synonymous with many emerging applications in the IoT, and as the technologies progress so do the markets that rely on those technologies. Flexible [getkc id="187" kc_name="sensors"] factor into a number of [getkc id="76" kc_name="IoT"] use cases such as agriculture, health care, and structural health monitoring. Other types of flexible de... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 05 May, 2017 - Comments: 0

Fab tools, test and packaging Brewer Science has sold its so-called Cee semiconductor processing equipment business. A former employee, Russ Pagel, has formed a new company, Cost Effective Equipment, to take over ownership and operate the Cee business. The new company, which will remain in Rolla, Mo., will sell spin coaters, bake plates, bonders and other systems. Taiwan’s Ministry of E... » read more

Flexible Sensors Begin Ramping
By Jeff Dorsch - 07 Apr, 2016 - Comments: 0

Sensors are at the heart of the [getkc id="76" comment="Internet of Things"]. Flexible sensors promise to extend the Internet of Everything to the battlefield, the gymnasium, the hospital, and many other places. Flexible [getkc id="187" kc_name="sensors"] represent the forefront of a sea of change in electronics, marking the transition from rigid semiconductors made with silicon and other ha... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 16 Jan, 2015 - Comments: 0

Historically, there has been a good correlation between oil prices and worldwide GDP growth, with lower prices correlating to stronger future growth. Given the current forecast for the price of oil in 2015, IC Insights expects oil prices to once again be a “tailwind” for worldwide GDP growth. Intel posted its sales and earnings for the fourth quarter. In 2015, Intel projects that its cap... » read more

Driving Innovation: From Talk to Action
By Karen Savala - 20 Feb, 2014 - Comments: 0

During the recent SEMI Industry Strategy Symposium, one of the themes focused on the challenges of building an innovative workforce with fresh ideas. KLA CEO and president Rick Wallace’s opening keynote address included an appeal for industry to actively recruit more young talent to foster greater levels of innovative thinking. He said that only four percent of the U.S. workforce is compos... » read more

Fab Tool Industry Has Lost Its Way
By Mark LaPedus - 23 Jan, 2014 - Comments: 1

The relationship between chipmakers and fab tool vendors has always been a bit rocky, but the supply chain has generally worked. Chipmakers demand a tool for a particular application. Then, tool makers attempt to deliver the goods, and ask few, if any, questions. Now, fab tool executives are beginning to ask some tough questions about the industry. And the tension is mounting between equ... » read more

Straight Talk On 3D TSVs
By Ed Sperling - 13 Dec, 2012 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss 3D device challenges and applications with John Lau, a fellow at the Industrial Technology Research Institute (ITRI), a research organization in Taiwan. SMD: What is ITRI doing in 3D TSVs? Lau: At ITRI we have developed the world’s first Applied Materials’ 300mm (3D TSV) integration line. The line was comple... » read more

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