The Week In Review: Manufacturing


Fab tools Samsung Electronics has broken ground on a new extreme ultraviolet (EUV) lithography facility in Hwaseong, South Korea. The new EUV facility is expected to be completed within the second half of 2019 with production slated for 2020. The initial investment in the new EUV line is projected to reach $6 billion by 2020. Imec and Cadence Design Systems have collaborated on the develop... » read more

The Week in Review: IoT


Finance Cincinnati-based Losant, which offers an enterprise Internet of Things platform, reports raising $5.2 million in Series A funding led by CincyTech. The Rise of the Rest Seed Fund, TechNexus, and Vine Street Ventures also participated in the new round. Losant says customers for its scalable IoT platform include Bosch, Hewlett Packard Enterprise, and Verizon Communications. SAM of Tel... » read more

Cheaper Packaging Options Ahead


Lower-cost packaging options and interconnects are either under development or just being commercialized, all of which could have a significant impact on the economics of advanced packaging. By far, the most cited reason why companies don't adopt advanced [getkc id="27" kc_name="packaging"] is cost. Currently, silicon [getkc id="204" kc_name="interposers"] add about $30 to the price of a med... » read more

The Materials Gap


When consolidation thinned the ranks of semiconductor foundries and equipment makers, materials companies figured things were about to get better. They haven't. There are a couple of reasons for this. First, semiconductors are now so complex and difficult to develop that a slew of innovations are required on all sides. Everyone is familiar with transistor structures, interconnects and lithog... » read more

Inside Panel-Level Fan-Out Technology


Semiconductor Engineering sat down to discuss panel-level fan-out packaging technology with Tanja Braun, deputy group manager at the Fraunhofer Institute for Reliability and Microintegration IZM, and Michael Töpper, business development manager at Fraunhofer IZM. Braun is responsible for the Panel Level Packaging Consortium at Fraunhofer IZM, as well as the group manager for assembly and encap... » read more

Flexible Devices Drive New IoT Apps


Printed and flexible electronics are becoming almost synonymous with many emerging applications in the IoT, and as the technologies progress so do the markets that rely on those technologies. Flexible [getkc id="187" kc_name="sensors"] factor into a number of [getkc id="76" kc_name="IoT"] use cases such as agriculture, health care, and structural health monitoring. Other types of flexible de... » read more

The Week In Review: Manufacturing


Fab tools, test and packaging Brewer Science has sold its so-called Cee semiconductor processing equipment business. A former employee, Russ Pagel, has formed a new company, Cost Effective Equipment, to take over ownership and operate the Cee business. The new company, which will remain in Rolla, Mo., will sell spin coaters, bake plates, bonders and other systems. Taiwan’s Ministry of E... » read more

Flexible Sensors Begin Ramping


Sensors are at the heart of the [getkc id="76" comment="Internet of Things"]. Flexible sensors promise to extend the Internet of Everything to the battlefield, the gymnasium, the hospital, and many other places. Flexible [getkc id="187" kc_name="sensors"] represent the forefront of a sea of change in electronics, marking the transition from rigid semiconductors made with silicon and other ha... » read more

The Week In Review: Manufacturing


Historically, there has been a good correlation between oil prices and worldwide GDP growth, with lower prices correlating to stronger future growth. Given the current forecast for the price of oil in 2015, IC Insights expects oil prices to once again be a “tailwind” for worldwide GDP growth. Intel posted its sales and earnings for the fourth quarter. In 2015, Intel projects that its cap... » read more

Driving Innovation: From Talk to Action


During the recent SEMI Industry Strategy Symposium, one of the themes focused on the challenges of building an innovative workforce with fresh ideas. KLA CEO and president Rick Wallace’s opening keynote address included an appeal for industry to actively recruit more young talent to foster greater levels of innovative thinking. He said that only four percent of the U.S. workforce is compos... » read more

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