tag: Brown University

Chip Industry Week In Review
By The SE Staff - 22 Nov, 2024 - Comments: 0

SK hynix started mass production of 1-terabit  321-high NAND, with availability scheduled for the first half of next year. Rapidus will receive an additional ¥200 billion yen ($1.28B) from the Japanese government beginning in fiscal year 2025, reports Nikkei. This is on top of ¥920 billion yen ($5.98B) Rapidus has already received from the government in support of its goal to reach commer... » read more

Security Technical Paper Roundup: Aug. 27
By Liz Allan - 27 Aug, 2024 - Comments: 0

A number of hardware security-related technical papers were presented at the August 2024 USENIX Security Symposium. The organization provides open access research, and the presentation slides and papers are free to the public. Topics include side-channel attacks and defenses, embedded security, fuzzing, fault injection, logic locking, Rowhammer, and more. Here are some highlights with associate... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 07 Jul, 2023 - Comments: 0

Joby Aviation and Alef Automotive each received a Special Airworthiness Certificate from the U.S. Federal Aviation Administration (FAA) for an electric vertical take-off and landing (eVTOL) aircraft. Joby will now begin flight testing the prototype, and the aircraft will move to Edwards Air Force Base in 2024 as part of a contract with the U.S. Air Force. Alef’s model is the first U.S. govern... » read more

Research Bits: Feb. 14
By Susan Rambo - 14 Feb, 2023 - Comments: 0

Defining Kagome superconductors An international team of scientists and researchers from the Brown University lab are now able to describe the structure of the superconductor Kagome metals. The team used nuclear magnetic resonance (NMR) imaging and a quantum modeling theory to describe the microscopic structure as the metal changed states into a charge density wave (CDW) state at 103°Kelvin (... » read more

Chip Industry’s Technical Paper Roundup: Nov. 21
By Linda Christensen - 21 Nov, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=65 /] » read more

Stabilizing A Hafnium Oxide-Based Thin Film When Sandwiched Between A Metal Substrate And An Electrode
By Technical Paper Link - 17 Nov, 2022 - Comments: 0

A technical paper titled "Origin of Ferroelectric Phase Stabilization via the Clamping Effect in Ferroelectric Hafnium Zirconium Oxide Thin Films" was published by researchers at University of Virginia, Brown University, Sandia National Labs, and Oak Ridge National Lab. Funding was given by U.S. DOE's 3D Ferroelectric Microelectronics Energy Frontier Research Center and the SRC. "This study ... » read more

Research Bits: June 21
By Jesse Allen - 21 Jun, 2022 - Comments: 0

Side-channel protection for edge AI Researchers from the Massachusetts Institute of Technology built a chip that can defend against power side-channel attacks targeting machine learning computations in smartwatches, smartphones, and tablets. Side-channel attacks involve observing a facet of the device's operation, in this case power, to deduce secrets. “The goal of this project is to buil... » read more

New Ways To Improve Batteries
By Katherine Derbyshire - 20 Jan, 2022 - Comments: 0

Researchers around the world are racing to develop more efficient, denser, and safer battery technology, and they are reaching far beyond where research has gone before. Much of this is being driven by concern over exhaust from internal combustion engines, which are responsible for a significant portion of global CO2 emissions. Nearly all carmakers today have announced plans to develop batte... » read more

Power/Performance Bits: May 25
By Jesse Allen - 25 May, 2021 - Comments: 0

5G energy harvesting Researchers at Georgia Institute of Technology propose a way to harvest power for IoT devices using 5G networks. The team's device uses a flexible Rotman lens-based rectifying antenna (rectenna) system capable of millimeter-wave harvesting in the 28-GHz band. “With this innovation, we can have a large antenna, which works at higher frequencies and can receive power fr... » read more

No Two Chips Are Alike
By Alex Burlak - 27 Jul, 2020 - Comments: 0

As semiconductor processes continue to shrink it’s becoming increasingly challenging to manage the parameters of individual devices not only across the diameter of the wafer, but also across the length of a single chip, especially for a complex chip with a large area. Today’s standard approach to this problem is to assume the worst case and to create a sub-optimal design that accommodates t... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy