Development Testing For C# Applications

By Synopsys - 28 Sep, 2016 - Comments: 0

Static analysis shouldn’t be about finding loads of coding style or standard issues. It should be focused on finding the most critical defects. Although traditional byte code analysis solutions such as FxCop are useful, they can miss critical, crash causing defects - plus produce a large set of coding style issues, which can slow down the development team. Learn how the Coverity Development T... » read more

Can Verification Meet In The Middle?

By Brian Bailey - 30 Jun, 2016 - Comments: 0

Since the dawn of time for the EDA industry, the classic V diagram has defined the primary design flow. On the left hand side of the V, the design is progressively refined and partitioned into smaller pieces. At the bottom of the V, verification takes over and as you travel up the right-hand side of the V, verification and integration happens until the entire design has been assembled and valid... » read more

ESL Flow is Dead

By Brian Bailey - 28 Apr, 2016 - Comments: 3

It was 20 years ago that Gary Smith coined the term [getkc id="48" comment="Electronic System Level"] (ESL). He foresaw the next logical migration in abstraction up from the [getkc id="49" comment="Register Transfer Level"] (RTL) to something that would be capable of describing and building complex electronic systems. He also saw that the future of EDA depended upon who would control that marke... » read more

Why I See C In SCE-MI

By Jacek Majkowski - 24 Mar, 2016 - Comments: 0

The two questions I hear most often while doing presentations about SCE-MI transaction based emulation are, “Can we have coffee break?” and “Why do we need a thin C layer between two SystemVerilog tops”? You a probably reading this during a coffee break, so let’s jump to second question. It refers to this diagram showing how to connect a SystemVerilog testbench (usually UVM) with D... » read more

Bridging Hardware And Software

By Ann Mutschler - 18 Jan, 2016 - Comments: 1

Methodology and reuse are two fairly standard concepts when it comes to semiconductor design, but they're viewed completely differently by hardware and software teams. It's a given that hardware and software have different goals and opinions about how best to do design. And while all agree that a single methodology can pay dividends in future chips, there is disagreement over who should shap... » read more

Blog Review: April 30

By Ed Sperling - 30 Apr, 2014 - Comments: 0

Applied Materials’ Jeremy Read points to a looming problem for the Internet of Things—legacy fabs that will require software upgrades and advanced process control. Also needed: Sensors attached to thousands of machines for predictive maintenance. Foundries are now ready for production finFETs. Cadence's Richard Goering captures the buzz at last week’s TSMC Tech Symposium, where the ro... » read more

Experts At The Table: The Future Of SystemC

By Ed Sperling - 28 Jun, 2012 - Comments: 0

By Ed Sperling System-Level Design moderated a discussion about the future of SystemC with Thomas Alsop, corporate design solution expert at Intel; Ambar Sarkar, chief verification technologist at Paradigm Works; Mike Meredith, vice president of technical marketing at Forte Design Systems; David Black, certified training instructor at Doulos. Here are some of the key outtakes of that discussio... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer