tag: Cadence Design Systems

Unleash The Potential of CFD
By Cadence - 09 Nov, 2022 - Comments: 0

Classic CFD to High-Order Scalability Instead of relying on expensive prototype testing or experimentation, users now have access to numerous open-source and paid computational fluid dynamics (CFD) software that can help them solve application-specific problems. Today, CFD is no longer about getting one solution at a time; it is about getting the best possible solution from multiple design tes... » read more

PCB Design From Start To Finish: E-Book
By Cadence - 02 Nov, 2022 - Comments: 0

This ebook by John Burkhert is a step-by-step guide on printed circuit board design with information suitable for beginners to graduate-level users. This series is for anyone who wants to design their own printed circuit boards or perform designs for others. While an electronics degree is not required, beginners would do well to consider basic electronic theory as a prerequisite. Each ... » read more

AI-Driven Big Data Analytics Enables Actionable Intelligence, Improving SoC Design Productivity
By Cadence - 26 Oct, 2022 - Comments: 0

As the latest systems on chip (SoCs) grow in size and complexity, a vast amount of design data is generated during verification and implementation. Design data is business critical and, with the proliferation of artificial intelligence (AI) use in chip design, provides designers an opportunity to carry forward learnings and insights with every new design. To achieve first-pass success deliverin... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 07 Oct, 2022 - Comments: 0

Automotive, mobility Infineon opened a new factory in Cegléd, Hungary, for assembly and test of high-power semiconductor modules for EVs. “The new manufacturing capacities will help Infineon accommodate the growing demand for electromobility applications,” said Infineon’s COO Rutger Wijburg in a press release. Production ramp-up started in February 2022. Infineon also announced it will ... » read more

Toward Domain-Specific EDA
By Brian Bailey - 26 Sep, 2022 - Comments: 0

More companies appear to be creating custom EDA tools, but it is not clear if this trend is accelerating and what it means for the mainstream EDA industry. Whenever there is change, there is opportunity. Change can come from new abstractions, new options for optimization, or new limitations that are imposed on a tool or flow. For example, the slowing of Moore's Law means that sufficient prog... » read more

Strengthening The Global Semi Supply Chain
By Ann Mutschler - 22 Sep, 2022 - Comments: 0

Within the semiconductor ecosystem, there are a number of dynamics pointing to the need for new ways of partnering in more meaningful ways that bring resiliency to the global semiconductor supply chain. One of these is the move to bespoke silicon, stemming from a shift in the companies that create most SoCs today -- the hyperscalar cloud providers. These market leaders know their workloads so w... » read more

Efficient Verification Of Mixed-Signal Series IP Using UVM
By Cadence - 21 Sep, 2022 - Comments: 0

Interface IP are an integral part of systems-on-chips (SoC) that include mobile, automotive, or networking applications and are primarily used for transmitting data over a physical medium between a host and device. The mixed-signal nature of the IP makes verification a challenging task, requiring special considerations for digital and analog sections. This paper describes a robust mixed-signal ... » read more

How Mature Are Verification Methodologies?
By Brian Bailey - 14 Sep, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss differences between hardware and software verification and changes and challenges facing the chip industry, with Larry Lapides, vice president of sales for Imperas Software; Mike Thompson, director of engineering for the verification task group at OpenHW; Paul Graykowski, technical marketing manager for Arteris IP; Shantanu Ganguly, vice president o... » read more

Designing For Thermal
By Karen Heyman - 13 Sep, 2022 - Comments: 0

Heat has emerged as a major concern for semiconductors in every form factor, from digital watches to data centers, and it is becoming more of a problem at advanced nodes and in advanced packages where that heat is especially difficult to dissipate. Temperatures at the base of finFETs and GAA FETs can differ from those at the top of the transistor structures. They also can vary depending on h... » read more

Preparation Of Geometry Models For Mesh Generation And CFD
By Cadence - 12 Sep, 2022 - Comments: 0

Making geometry models suitable for CFD meshing is a time-consuming bottleneck in CFD analysis. We will discuss why and ways to fix the problems. Click here to read more. » read more

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