tag: Cadence

Options Widen For Optimizing IoT Designs
By John Koon - 29 Mar, 2023 - Comments: 0

Creating a successful IoT design requires a deep understanding of the use cases, and a long list of tradeoffs among various components and technologies to provide the best solution at the right price point. Maximizing features and functions while minimizing costs is an ongoing balancing act, and the number of choices can be overwhelming. The menu includes SoC selection, OS and software proto... » read more

Blog Review: March 29
By Jesse Allen - 29 Mar, 2023 - Comments: 0

Siemens' Heather George suggests adopting a shift-left strategy for complex designs that integrate multiple dies into a package and examines the challenges and opportunities for performing comprehensive tests on 2.5D and 3D IC designs. Synopsys' Shekhar Kapoor notes that when considering whether a system will perform as intended, techniques that work well for monolithic SoCs may not be as we... » read more

Chip Industry’s Technical Paper Roundup: Mar. 28
By Linda Christensen - 28 Mar, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=89 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

AI Becoming More Prominent In Chip Design
By Ed Sperling - 27 Mar, 2023 - Comments: 0

Semiconductor Engineering sat down to talk about the role of AI in managing data and improving designs, and its growing role in pathfinding and preventing silent data corruption, with Michael Jackson, corporate vice president for R&D at Cadence; Joel Sumner, vice president of semiconductor and electronics engineering at National Instruments; Grace Yu, product and engineering manager at Meta... » read more

3D-IC: Operator Learning Framework For Ultra-Fast 3D Chip Thermal Prediction Under Multiple Chip Design Configurations
By Technical Paper Link - 24 Mar, 2023 - Comments: 0

A new technical paper titled "DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design" was published (preprint) by researchers at UCSB and Cadence. Abstract "Thermal issue is a major concern in 3D integrated circuit (IC) design. Thermal optimization of 3D IC often requires massive expensive PDE simulations. Neural network-based thermal prediction models can perform ... » read more

True 3D Is Much Tougher Than 2.5D
By Brian Bailey - 23 Mar, 2023 - Comments: 0

Creating real 3D designs is proving to be much more complex and difficult than 2.5D, requiring significant innovation in both technology and tools. While there has been much discussion about 3D designs, there are multiple interpretations about what 3D entails. This is more than just semantics, however, because each packaging option requires different design approaches and technologies. And a... » read more

The Race Toward Mixed-Foundry Chiplets
By Ann Mutschler - 23 Mar, 2023 - Comments: 1

Creating chiplets with as much flexibility as possible has captured the imagination of the semiconductor ecosystem, but how heterogeneous integration of chiplets from different foundries will play out remains unclear. Many companies in the semiconductor ecosystem are still figuring out how they will fit into this heterogeneous chiplet world and what issues they will need to solve. While near... » read more

Like Wayne Gretzky, EDA Aims To Be Where The Puck Is Going, Not Where It Has Been
By Paul Scannell - 23 Mar, 2023 - Comments: 0

When I launched this blog series, I set out to share some of the more unique industry transitions I’ve witnessed over my 20+ year career in EDA. The B2B sales process has not been immune to change and transition. In fact, you could create a college curriculum with a daunting syllabus on the major transitions that have impacted the B2B sales process. I won’t drop that on you. The room wh... » read more

Managing EDA’s Rapid Growth Expectations
By Brian Bailey - 23 Mar, 2023 - Comments: 0

The EDA industry has been doing very well recently, but how long this run will continue is a matter of debate. EDA is an industry ripe for disruption due to rapid changes in chip architectures, end markets, and a long list of new technologies. In addition, recent geopolitical tensions are bringing a lot more attention to this small sector upon which the whole semiconductor industry rests. De... » read more

Blog Review: March 22
By Jesse Allen - 22 Mar, 2023 - Comments: 0

Siemens EDA's Dan Yu warns that the unavailability of verification data is slowing down the development of advanced machine learning for verification, with valuable data assets either siloed among different team members or projects or simply discarded due to the lack of analytic techniques to extract value from them. Synopsys' Richard Solomon and Dana Neustadter point to the need for hardwar... » read more

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