Blog Review: Aug. 10

By Jesse Allen - 10 Aug, 2022 - Comments: 0

Siemens' Heather George provides a primer on 3D IC, including the problems it is trying to solve, what differentiates it from other multi-chip technologies, and some of the unique challenges in 3D integration. Cadence's Paul McLellan shares highlights from the Automobil Elektronik Kongress, including how the increasing amount of software in a car is driving disruption in the automotive suppl... » read more

Where Are The Autonomous Cars?

By Marie C. Baca - 08 Aug, 2022 - Comments: 0

Are we there yet? Governments, consumers, and engineers alike want to know how close the automotive world is to producing a fully autonomous Level 5 vehicle. While some experts say such vehicles could hit the road in the next few years, they're a shrinking minority. Most forecasts say a truly self-driving car is at least a decade away — and maybe much longer, because it requires disruptive... » read more

Week In Review: Design, Low Power

By Marie C. Baca - 05 Aug, 2022 - Comments: 0

Quantum Computing Researchers in China are putting a damper on Google’s claims of achieving quantum supremacy after they were able to use normal processors to complete a difficult calculation in a few hours. Sycamore, Google’s quantum computer, completed the same calculation in a few minutes back in 2019, but the company said it would take a supercomputer more than 10,000 years to do the... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 05 Aug, 2022 - Comments: 0

Pervasive computing, connectivity Semtech Corporation announced that it will acquire Sierra Wireless, an IoT services company. The acquisition will combine Semtech’s LoRa end nodes and cloud service with Sierra Wireless’ cellular capabilities. Telit will incorporate Thales’s cellular IoT products business under a new name Telit Cinterion, led by Telit. Telit Cinterion will be Californ... » read more

Cities Strive For More Smarts, Security

By Susan Rambo - 04 Aug, 2022 - Comments: 0

As cities around the world move beyond their first completed smart city projects and add more systems, they face hurdles in expanding but have more standards, technical resources, and real-world examples to draw on when making project design decisions. The main concern is keeping the smart city systems and their data and functions safe, especially if the system is touching critical infrastructu... » read more

AEK: Powerpoint Is Easy—Change is Hard

By Paul McLellan - 04 Aug, 2022 - Comments: 0

A major message to big-name automakers at the Automobil Elektronik Kongress 2022 was, "You old-time car guys don't get it. We have to deliver a smartphone experience in a vehicle. If not, we will be out of our jobs, and someone else will." CARIAD I thought that the most interesting presentation was by Riclef Schmidt-Clausen of CARIAD. CARIAD is a spinout from Volkswagen (VW) of their software... » read more

Is Standardization Required For Security?

By Ann Mutschler - 04 Aug, 2022 - Comments: 1

Semiconductor Engineering sat down to discuss chip and system security with Mike Borza, fellow and scientist on the security IP team at Synopsys; Lee Harrison, automotive IC test solutions manager at Siemens Digital Industries Software; Jason Oberg, founder and CTO of Cycuity (formerly Tortuga Logic); Nicole Fern, senior security analyst at Riscure; Norman Chang, fellow and CTO of the electroni... » read more

Blog Review: Aug. 3

By Jesse Allen - 03 Aug, 2022 - Comments: 0

Siemens' Patrick Hope explains the growing importance of choosing the right laminate for PCB designs and how to read a material datasheet to compare important electrical, thermal, and mechanical properties. Synopsys' Yankin Tanurhan argues that as the number of sensors being integrated in automotive systems increases to enable new ADAS and autonomy capabilities, building security and quality... » read more

Need Design Talent? Create a Contest

By Marie C. Baca - 02 Aug, 2022 - Comments: 0

Amid a labor crunch for qualified engineers, semiconductor ecosystem participants are coming up with new strategies to entice university students, such as design competitions. In one design competition sponsored by Renesas earlier this year for European university students and their educators, teams were tasked with building a self-guided robot that could drive along a track in a virtual sim... » read more

Week In Review, Design, Low Power

By Marie C. Baca - 29 Jul, 2022 - Comments: 0

Financial News Cadence announced second quarter revenue of $858 million, an increase of 17.9% compared with the same period a year ago when revenue was $728 million. President and CEO Anirudh Devgan said the company’s results are “emblematic of the megatrends of the long-term strength of semis, systems companies investing more in silicon, and the convergence of system and chip designs.�... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?