Week In Review: Semiconductor Manufacturing, Test

By Karen Heyman - 22 Dec, 2022 - Comments: 0

SEMI , SEMI Europe and European Commission representatives, in consultation with semiconductor industry stakeholders, proposed initiatives to overcome the skills shortage in Europe’s microelectronics industry: Create an industry image campaign to raise public awareness on how technology is shaping the future, and how workers can establish careers in the semiconductor industry. Remove ... » read more

The Week In Review: Design

By Jesse Allen - 15 Jun, 2018 - Comments: 0

M&A MIPS has reportedly been acquired again, this time by AI startup Wave Computing. Wave focuses on data center-based neural network training using its parallel dataflow processing architecture. In March, the company signed on to use 64-bit multi-threaded processor cores from MIPS in future projects. Previously, MIPS was owned by Tallwood Venture Capital, which acquired MIPS from Imaginat... » read more

Manufacturing Bits: May 9

By Mark LaPedus - 09 May, 2017 - Comments: 0

China’s quantum computer In its latest achievement, China has built a quantum computer. With its technology, the University of Science and Technology of China and Zhejiang University claimed to have set two records in quantum computing. In classical computing, the information is stored in bits, which can be either a “0” or “1”. In quantum computing, information is stored in quant... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Cambricon Technologies

Week In Review: Semiconductor Manufacturing, Test

The Week In Review: Design

Manufacturing Bits: May 9