Plotting IBM Micro’s Future

By Mark LaPedus - 14 Aug, 2014 - Comments: 1

It’s been a wild ride for IBM’s Microelectronics Group. Neither IBM, nor the other parties involved, have made any public comments about the recent events concerning IBM Micro. Much of the drama has played out in the media. Based on those reports, here’s a rough outline of the events. Not long ago, IBM put its loss-ridden chip unit on the block to shore up the company’s bottom lin... » read more

Manufacturing Bits: August 5

By Mark LaPedus - 05 Aug, 2014 - Comments: 0

Double Big Mac chips Using molecular beam epitaxy (MBE), Cornell has devised a method of growing an emerging class of oxide films called Ruddlesden-Poppers. These oxides are layered structures, which consist of 2D-based perovskite slabs interleaved with cations. In the future, these structures could be used in various applications, such as superconductivity, magnetoresistance and ferromagne... » read more

Will 7nm And 5nm Really Happen?

By Mark LaPedus - 14 Jul, 2014 - Comments: 2

Today’s silicon-based finFETs could run out of steam at 10nm. If or when chipmakers move beyond 10nm, IC vendors will require a new transistor architecture. III-V finFETs, gate-all-around FETs, quantum well finFETs, SOI finFETs and vertical nanowires are just a few of the future transistor candidates at 7nm and 5nm. Technically, it’s possible to manufacture the transistor portions of the... » read more

System Bits: July 8

By Ann Mutschler - 08 Jul, 2014 - Comments: 0

Carbon nanotubes “unzipped” into graphene nanoribbons by a chemical process invented at Rice University are finding use in all kinds of projects, but Rice scientists have now found a chemical-free way to unzip them. A Rice materials scientist discovered that nanotubes that hit a target end first turn into mostly ragged clumps of atoms, but nanotubes that happen to broadside the target un... » read more

Power/Performance Bits: June 17

By Ann Mutschler - 17 Jun, 2014 - Comments: 0

Nanotubes boost terahertz detectors Researchers at Rice University, Sandia National Laboratories and the Tokyo Institute of Technology have developed novel terahertz detectors based on carbon nanotubes that could improve medical imaging, airport passenger screening, food inspection and other applications. Unlike current terahertz detectors, the devices are flexible, sensitive to polarizatio... » read more

Manufacturing Bits: May 27

By Mark LaPedus - 27 May, 2014 - Comments: 0

Chip printing process Fraunhofer Institute for Manufacturing Technology and Advanced Materials has developed a novel way to make systems using electronic components, such as resistors, transistors and capacitors. Researchers use simple printers and a robot-assisted production line. The components and other devices made from the technology could be used in various applications, such as digit... » read more

Manufacturing Bits: May 20

By Mark LaPedus - 20 May, 2014 - Comments: 0

Brain chips Pennsylvania State University has developed a technology that could enable futuristic biochips, namely those that mimic the human brain. In the lab, Penn State combined a thin film of vanadium dioxide (VO2) on a titanium dioxide substrate to create an oscillating switch. VO2 is an exotic material that exhibits semiconductor-to-metal transitions at 68 °C. In the R&D stage fo... » read more

Power/Performance Bits: April 29

By Ann Mutschler - 29 Apr, 2014 - Comments: 0

Lithium-free flexible battery A Rice University laboratory has flexible, portable and wearable electronics in its sights with the creation of a thin film for energy storage. The researchers have developed a flexible material with nanoporous nickel-fluoride electrodes layered around a solid electrolyte to deliver battery-like supercapacitor performance that combines the best qualities of a h... » read more

Manufacturing Bits: April 15

By Mark LaPedus - 15 Apr, 2014 - Comments: 0

Self-assembled nano-walls Using a self-assembly process, Texas A&M University and the International Institute for Carbon-Neutral Energy Research have devised a new technology called “nano-walls.” [caption id="attachment_11488" align="alignnone" width="499"] Researchers use common spray gun to create self-assembling nanoparticle films. (Source: Texas A&M).[/caption] Researcher... » read more

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Knowledge Centers
Entities, people and technologies explored

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3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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Key Technologies To Extend EUV To 14 Angstroms

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What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

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