tag: Carnegie Mellon University

An Eco-Friendly Conductive Ink For Thin-Film Electronics
By Technical Paper Link - 06 Sep, 2023 - Comments: 0

A technical paper titled “Recyclable Thin-Film Soft Electronics for Smart Packaging and E-Skins” was published by researchers at Carnegie Mellon University and University of Coimbra. Abstract: Despite advances in soft, sticker-like electronics, few efforts have dealt with the challenge of electronic waste. Here, this is addressed by introducing an eco-friendly conductive ink for thin-film... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 04 Aug, 2023 - Comments: 0

Hyundai, Samsung Catalyst Fund, and others invested a combined $100 million in Canada-based Tenstorrent to accelerate the design and development of AI chiplets and machine-learning software and allow the integration of AI into future Hyundai, Kia, and Genesis vehicles, plus other future mobilities such as robotics and advanced air mobility (AAM). The National Highway Traffic Safety Administr... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 07 Jul, 2023 - Comments: 0

Joby Aviation and Alef Automotive each received a Special Airworthiness Certificate from the U.S. Federal Aviation Administration (FAA) for an electric vertical take-off and landing (eVTOL) aircraft. Joby will now begin flight testing the prototype, and the aircraft will move to Edwards Air Force Base in 2024 as part of a contract with the U.S. Air Force. Alef’s model is the first U.S. govern... » read more

Chip Industry’s Technical Paper Roundup: July 5
By Liz Allan - 05 Jul, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=114 /] (more…) » read more

Self-Driving Cars: Formalization and Verification Of The Responsibility-Sensitive Safety (RSS) Model
By Technical Paper Link - 28 Jun, 2023 - Comments: 0

A technical paper titled “Slow Down, Move Over: A Case Study in Formal Verification, Refinement, and Testing of the Responsibility-Sensitive Safety Model for Self-Driving Cars” was published by researchers at Carnegie Mellon University. Abstract: "Technology advances give us the hope of driving without human error, reducing vehicle emissions and simplifying an everyday task with the futur... » read more

Week In Review: Semiconductor Manufacturing, Test
By Susan Rambo - 23 Jun, 2023 - Comments: 0

The CHIPS for America team at the U.S. Department of Commerce named the selection committee who will select board members for the nonprofit entity that will likely be managing the National Semiconductor Technology Center (NSTC). Members include John Hennessy, chairman of Alphabet; Jason Matheny, president and CEO of the RAND Corporation; Don Rosenberg, fellow in residence at UCSD’s School of ... » read more

Chip Industry’s Technical Paper Roundup: Mar. 21
By Linda Christensen - 21 Mar, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=88 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Reducing The Cost of Cache Coherence By Integrating HW Coherence Protocol Directly With The Programming Language
By Technical Paper Link - 19 Mar, 2023 - Comments: 0

A new technical paper titled "WARDen: Specializing Cache Coherence for High-Level Parallel Languages" was published by researchers at Northwestern University and Carnegie Mellon University. Abstract: "High-level parallel languages (HLPLs) make it easier to write correct parallel programs. Disciplined memory usage in these languages enables new optimizations for hardware bottlenecks, such ... » read more

FPGA-based Infrastructure, With RISC-V Prototype, to Enable Implementation & Evaluation of Cross-Layer Techniques in Real HW (Best Paper Award)
By Technical Paper Link - 15 Mar, 2023 - Comments: 0

A technical paper titled "MetaSys: A Practical Open-Source Metadata Management System to Implement and Evaluate Cross-Layer Optimizations" was published by researchers at University of Toronto, ETH Zurich, and Carnegie Mellon University. This paper won the Best Paper Award at the HiPEAC 2023 conference. Abstract: "This paper introduces the first open-source FPGA-based infrastructure, MetaSy... » read more

Week In Review: Semiconductor Manufacturing & Test
By Gregory Haley - 17 Feb, 2023 - Comments: 0

The Biden Administration’s export bans for semiconductor manufacturing equipment are delaying expansion plans for Chinese chipmakers, Nikkei Asia reports. Yangtze Memory Technologies (YMTC) has halted work on its second memory plant near Wuhan, and ChangXin Memory Technologies (CMTX) says its second production facility, slated to open in 2023, will be delayed until 2024 or 2025. In an effo... » read more

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