tag: CEA-Leti

Blog Review: May 8
By Jesse Allen - 08 May, 2019 - Comments: 0

Synopsys' Taylor Armerding warns that the threat of cyber war on the financial system is a real possibility and points to four major vulnerability concerns. Cadence's Meera Collier takes a look at bees and technology, from smart hives to sensors that can be carried on the insects' backs. Mentor's Brent Klingforth argues that electrical and mechanic designers need to seamlessly share infor... » read more

MRAM: from STT to SOT, for security and memory
By Technical Paper Link - 30 Apr, 2019 - Comments: 0

Abstract: "Spin Transfer Torque Magnetic Random Access Memory (STT-MRAM) is one of the leading candidates for embedded memory convergence in advanced technology nodes. It is particularly adapted to low-power applications, requiring a decent level of performance. However, it also have interests for secured applications. The PRESENT cipher is a lightweight cryptographic algorithm targeting ultra... » read more

Power/Performance Bits: Feb. 26
By Jesse Allen - 26 Feb, 2019 - Comments: 0

Integrated RRAM for edge AI Researchers at CEA-Leti and Stanford University have developed the first circuit integrating multiple-bit non-volatile Resistive RAM (RRAM) with silicon computing units, as well as new memory resiliency features that provide 2.3-times the capacity of existing RRAM. The proof-of-concept chip monolithically integrates two heterogeneous technologies: 18KB of on-chip... » read more

Manufacturing Bits: Jan. 2
By Mark LaPedus - 02 Jan, 2019 - Comments: 0

Better nanowire MOSFETs At the recent IEEE International Electron Devices Meeting (IEDM), Imec and Applied Materials presented a paper on a new and improved way to fabricate vertically stacked gate-all-around MOSFETs. More specifically, Imec and Applied reported on process improvements for a silicon nanowire MOSFET, which is integrated in a CMOS dual work function metal replacement metal ga... » read more

Manufacturing Bits: Nov. 27
By Mark LaPedus - 27 Nov, 2018 - Comments: 0

New kilogram definition After years of debate and scientific work, a group of delegates from 60 countries have voted to redefine four key unit measurements—the kilogram, electric current (ampere), temperature (kelvin), and the amount of substance (mole). The vote took place at the recent 26th General Conference of Weights and Measures. Hosted by the International Bureau of Weights and Mea... » read more

Practical Methods To Overcome The Challenges Of 3D Logic Design
By Benjamin Vincent - 25 Jun, 2018 - Comments: 0

What should you do If you don’t have enough room on your floor to store all your old boxes? Luckily, we live in a 3D world, and you can start stacking them on top of each other. The Challenge: How can we shrink logic devices? Logic designers are currently facing even bigger challenges than you might be having in tidying up your storage area. Not only are logic cells highly packed together... » read more

SOS Collaboration Platform: Powering The Next Discoveries In Physics
By Ranjit Adhikary - 03 Aug, 2017 - Comments: 0

The world is on the cusp of some of the greatest scientific breakthroughs in human history. The experiments physicists are carrying out today will shed new light on how our universe works. The Large Hadron Collider (LHC), a $10 billion project, unleashed a new perspective of how our universe works by letting us take a look at how tiny particles interact. You can forgive the physicists workin... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 02 Dec, 2016 - Comments: 0

Manufacturing There are more changes at SEMI. SEMI has named David Anderson as president of the SEMI Americas region. Most recently, Anderson was chief executive and chairman of Novati, a specialty manufacturing fab. He replaces Karen Savala, who was president of the SEMI Americas region for six years. In an e-mail, Savala confirmed she left SEMI in October. Meanwhile, in October, SEMI an... » read more

System Bits: Nov. 29
By Ann Mutschler - 29 Nov, 2016 - Comments: 0

Qubit device fabbed in standard CMOS In a major step toward commercialization of quantum computing, Leti, an institute of CEA Tech, along with Inac, a fundamental research division of CEA, and the University of Grenoble Alpes have achieved the first demonstration of a quantum-dot-based spin qubit using a device fabricated on a 300-mm CMOS fab line. Maud Vinet, Leti’s advanced CMOS manager... » read more

GlobalFoundries Rolls Out 12nm FD-SOI Process
By Jeff Dorsch - 08 Sep, 2016 - Comments: 0

GlobalFoundries uncorked its 12FDX platform, incorporating a 12nm fully-depleted silicon-on-insulator process technology. The foundry’s Fab 1 in Dresden, Germany, will support customer development with the 12nm process, with product tape-outs scheduled for the first six months of 2019. The 12FDX technology follows the company’s 22FDX platform involving a 22-nanometer process. The foundr... » read more

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