tag: CEA

Spin–Orbit Qubit With A Single Hole Electrostatically Confined In A Natural Silicon Metal-Oxide-Semiconductor Device
By Technical Paper Link - 28 Sep, 2022 - Comments: 0

A new technical paper titled "A single hole spin with enhanced coherence in natural silicon" was published by researchers at Université Grenoble Alpes, CEA, LETI, and CNRS. Abstract: "Semiconductor spin qubits based on spin–orbit states are responsive to electric field excitations, allowing for practical, fast and potentially scalable qubit control. Spin electric susceptibility, however,... » read more

Technical Paper Round-Up: June 21
By Linda Christensen - 21 Jun, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=34 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

End-to-End System for Object Localization By Coupling pMUTs to a Neuromorphic RRAM-based Computational Map
By Technical Paper Link - 20 Jun, 2022 - Comments: 0

New research paper titled "Neuromorphic object localization using resistive memories and ultrasonic transducers" from researchers at CEA, LETI, Université Grenoble Alpes and others. Abstract "Real-world sensory-processing applications require compact, low-latency, and low-power computing systems. Enabled by their in-memory event-driven computing abilities, hybrid memristive-Complementary... » read more

Factoring 2048-bit RSA Integers in 177 Days with 13 436 Qubits and a Multimode Memory
By Technical Paper Link - 18 Nov, 2021 - Comments: 0

Abstract: "We analyze the performance of a quantum computer architecture combining a small processor and a storage unit. By focusing on integer factorization, we show a reduction by several orders of magnitude of the number of processing qubits compared with a standard architecture using a planar grid of qubits with nearest-neighbor connectivity. This is achieved by taking advantage of a tem... » read more

Manufacturing Bits: Dec. 29
By Mark LaPedus - 29 Dec, 2020 - Comments: 1

Chiplet-based exascale computers At the recent IEEE International Electron Devices Meeting (IEDM), CEA-Leti presented a paper on a 3D chiplet technology that enables exascale-level computing systems. The United States and other nations are working on exascale supercomputers. Today’s supercomputers are measured in floating point operations per second. The world’s fastest supercomputers c... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 13 Jul, 2018 - Comments: 0

Chipmakers GlobalFoundries said that the company’s 22nm FD-SOI technology has delivered more than $2 billion worth of client design win revenue. With more than 50 total client designs, the technology is designed for automotive, 5G connectivity and the Internet of Things (IoT). Helic has announced that its electromagnetic (EM) modeling engine has been certified for GlobalFoundries’ 22nm ... » read more

The Week In Review: Design
By Jesse Allen - 17 Nov, 2017 - Comments: 0

Tools Aldec released the latest version of its Riviera-PRO verification platform, adding QEMU Bridge to enable hardware/software co-simulation of designs intended to run on SoC FPGAs. Other features include improved performance when using code containing many inline randomized calls and up to 29% faster simulation speed of UVM. Pulsic added new features to its Unity Bus Planner for planning... » read more

Manufacturing Bits: June 21
By Mark LaPedus - 21 Jun, 2016 - Comments: 0

Atomic sculpting Oak Ridge National Laboratory has combined a scanning transmission electron microscope (STEM) with new electronic controls. This tool enables the construction, or the atomic sculpting, of 3D-like feature sizes down to 1nm and 2nm. To achieve these dimensions, the STEM is controlled with a special set of programmable electronics. This, in turn, enables the STEM to tunnel in... » read more

Manufacturing Bits: May 31
By Mark LaPedus - 31 May, 2016 - Comments: 0

Superconducting magnets The National High Magnetic Field Laboratory (MagLab) has broken another world’s magnet record. This time, MagLab broke a record for a high-temperature superconducting (HTS) coil operating inside a high-field resistive magnet. With the technology, the agency achieved a magnetic field of 40.2 teslas. The previous record was 35.4 teslas. Tesla, or T, is the measuremen... » read more

Flexible Sensors Begin Ramping
By Jeff Dorsch - 07 Apr, 2016 - Comments: 0

Sensors are at the heart of the [getkc id="76" comment="Internet of Things"]. Flexible sensors promise to extend the Internet of Everything to the battlefield, the gymnasium, the hospital, and many other places. Flexible [getkc id="187" kc_name="sensors"] represent the forefront of a sea of change in electronics, marking the transition from rigid semiconductors made with silicon and other ha... » read more

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