tag: CEVA

The Week In Review: Design
By Jesse Allen - 24 Feb, 2017 - Comments: 0

M&A ARM made two acquisitions to add the new NarrowBand-IoT (NB-IoT) low power wide area connectivity standard to its designs: Mistbase, founded in 2015 in Sweden, provides a complete NB-IoT physical layer implementation solution, while London-based NextG-Com, founded in 2008, offers a complete layer two and three software stack for NB-IoT. Tools Synopsys released the latest versio... » read more

The Week In Review: IoT
By Jeff Dorsch - 16 Dec, 2016 - Comments: 0

Tools Google this week updated its Internet of Things platform, releasing a Developer Preview for Android Things, enabling application developers to create IoT devices running on the mobile Android operating system. “We incorporated the feedback from Project Brillo to include familiar tools such as Android Studio, the Android Software Development Kit (SDK), Google Play Services, and Google C... » read more

The Week In Review: Design
By Jesse Allen - 09 Dec, 2016 - Comments: 0

Standards The latest version of the Bluetooth standard was ratified by the Bluetooth Special Interest Group. Key updates in Bluetooth 5 include four times range, two times speed, and eight times broadcast message capacity, as well as updates that help reduce potential interference with other wireless technologies. Tools Synopsys updated its hierarchical static timing analysis tool for ... » read more

The Week In Review: IoT
By Jeff Dorsch - 21 Oct, 2016 - Comments: 0

Security The Defense Advanced Research Projects Agency (DARPA) in August held the finals of its Cyber Grand Challenge, a competition that came down to seven teams in Las Vegas, with the three winning teams sharing cash prizes totaling $3.75 million. The capture-the-flag style contest let cybersecurity software counter various attacks on its own, without the aid of engineers and programmers. Th... » read more

The Week In Review: IoT
By Jeff Dorsch - 14 Oct, 2016 - Comments: 0

Memory Kilopass Technology uncorked its new eNVM, which includes vertical layered thyristor DRAM technology. The key advantages, according to the company, is that it eliminates the need for DRAM refresh, can be manufactured using existing processes, and improves power and area efficiency. A full memory test chip is currently in the early stages of testing. A thyristor is basically a latch tech... » read more

Seeing The Future Of Vision
By Jeff Dorsch - 13 Oct, 2016 - Comments: 0

Vision systems have evolved from cameras that enable robots to “see” on a factory floor to a safety-critical element of the heterogeneous systems guiding autonomous vehicles, as well as other applications that call for parallel processing technology to quickly recognize objects, people, and the surrounding environment. Automotive electronics and mobile devices currently dominate embedded... » read more

The Week In Review: Design/IoT
By Jesse Allen - 20 Nov, 2015 - Comments: 0

Mergers & Acquisitions On Semiconductor signed a definitive agreement to buy Fairchild Semiconductor for $2.4 billion in cash, combining forces in the power semiconductor market. The deal is the latest in a series of acquisitions and combinations as companies position themselves for the IoT/IoE/IIoT, a world of connected devices that spans from industrial to automotive to smartphones. Comp... » read more

The Week In Review: Design/IoT
By Jesse Allen - 23 Oct, 2015 - Comments: 0

M&A ARM acquired Carbon Design Systems and its staff for an undisclosed sum, adding virtual prototyping capabilities for ARM cores. In 2008, ARM sold Carbon the tools it acquired in the 2004 purchase of virtual prototype development company AXYS Design Automation. Tools Mentor Graphics updated its PADS software, adding 3D tool capabilities to provide visualization, placement, and d... » read more

The Week In Review: Design/IoT
By Jesse Allen - 09 Oct, 2015 - Comments: 0

Imec and Cadence completed the first tapeout of a 5nm test chip. Using a processor design, the companies taped out a set of designs using EUV lithography as well as Self-Aligned Quadruple Patterning for 193i lithography, where metal pitches were scaled from the nominal 32nm pitch down to 24nm to push the limit of patterning. Tools Synopsys folded in recent acquisition Atrenta's testabilit... » read more

Blog Review: Aug. 19
By Jesse Allen - 19 Aug, 2015 - Comments: 1

Several of this week's top reads from Ansys' Justin Nescott sound like they're straight from the pages of sci-fi novels (and comic books). An MIT project is getting close to creating the Iron Man suit, one company plans to finally build a space elevator, and Los Angeles takes an innovative approach to fighting the California drought: 96 million black plastic balls. Smartphones are so yestery... » read more

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