tag: chip package interaction

Predicting Warpage in Different Types of IC Stacks At Early Stage Of Package Design
By Technical Paper Link - 15 Mar, 2024 - Comments: 0

A new technical paper titled "Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects" was published by researchers at Siemens EDA, D2S, and Univ. Grenoble Alpes, CEA, Leti. Abstract: "A physics-based multi-scale simulation methodology that analyses die stress variations generated by package fabrication is employed for warpage study. The ... » read more

Making Chip Packaging More Reliable
By Mark LaPedus - 15 Apr, 2021 - Comments: 0

Packaging houses are readying the next wave of IC packages, but these products must prove to be reliable before they are incorporated into systems. These packages involve several advanced technologies, such as 2.5D/3D, chiplets and fan-out, but vendors also are working on new versions of more mature package types, like wirebond and leadframe technologies. As with previous products, packaging... » read more

Why Use A Package?
By Ed Sperling - 21 Jan, 2016 - Comments: 0

Subramanian Iyer, distinguished chancellor's professor in UCLA's Electrical Engineering Department—and a former fellow and director of the systems scaling technology department at IBM—sat down with Semiconductor Engineering to talk about the future of chip scaling. What follows are excerpts of that conversation. SE: Advanced packaging is being viewed as a way to extend scaling in the fut... » read more

The Growing Role Of Extended Supply Chain Collaboration
By Karen Savala - 19 Nov, 2015 - Comments: 0

At the executive keynote panel held at Semicon West 2015, one of the key industry challenges discussed was the growing need for closer collaboration between supply chain partners in order to support the fast time to market and shortened product lifecycles of today’s consumer electronics. Traditionally, the yield ramp phase has been a critical time to resolve manufacturing issues, enable high ... » read more

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