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Holistic Die-to-Die Interface Design Methodology for 2.5-D Multichip-Module Systems


Abstract: "More than Moore technologies can be supported by system-level diversification enabled by chiplet-based integrated systems within multichip modules (MCMs) and silicon interposer-based 2.5-D systems. The division of large system-on-chip dies into smaller chiplets with different technology nodes specific to the chiplet application requirement enables the performance enhancement at the ... » read more

Signal Integrity’s Growing Complexity


By Matt Elmore While in the market for a memory upgrade recently, I was surprised by the availability of commercial DDR memories. You can get 8GB of DDR3 memory, transferring 17GB/s, relatively inexpensively. The progress in memory design is outstanding. From smartphones to gaming PCs, quick communication between the IC and off-chip memory is key to enabling the performance we demand in the... » read more