Rethinking Design, Workflow For 3D


In the 3D world, where NAND has hundreds of layers and packages come in intricate stacks, fresh graduates and veteran engineers alike are being confronted with design challenges that require a rethinking of both classic designs and traditional workflows, but without breaking the laws of physics. “There are pockets of things that have been on 3D for quite some time,” said Kenneth Larson, ... » read more

Gearing Up For Hybrid Bonding


Hybrid bonding is becoming the preferred approach to making heterogeneous integration work, as the semiconductor industry shifts its focus from 2D scaling to 3D scaling. By stacking chiplets vertically in direct wafer-to-wafer bonds, chipmakers can leapfrog attainable interconnection pitch from 35µm in copper micro-bumps to 10µm or less. That reduces signal delay to negligible levels and e... » read more

Heterogeneous Integration Finding Its Footing


Semiconductor Engineering sat down to discuss heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology; Shekhar Kapoor, senior director of product management at Synopsys; John Park, product management group director in Cadence's Custom IC & PCB Group; and Tony Mastroianni, advanced packagin... » read more

Looking Forward To The New Chip Cycle


Charles Shi, Principal and Senior Analyst at Needham & Company, LLC., remains upbeat about the EDA, IP and services business, or what SEMI refers to as the electronic system design (ESD) ecosystem. I recently spoke with Shi about his talk “Looking Forward to the New Chip Cycle” during the opening of the 2023 Design Automation Conference, collocated in July with SEMICON West in San Fra... » read more

Why Using Commercial Chiplets Is So Difficult


Experts at the Table: Semiconductor Engineering sat down to discuss use cases and challenges for commercial chiplets with Saif Alam, vice president of engineering at Movellus; Tony Mastroianni, advanced packaging solutions director at Siemens Digital Industries Software; Mark Kuemerle, vice president of technology at Marvell; and Craig Bishop, CTO at Deca Technologies. What follows are excerpts... » read more

How Multi-Die Systems Are Transforming Electronic Design


How can the electronics industry continue as Moore’s law slows, system complexity increases, and the number of transistors balloons to trillions? Multi-die systems have emerged as the solution to go beyond Moore’s law and address the challenges of systemic complexity, allowing for accelerated, cost-effective scaling of system functionality, reduced risk and time to market, lower system p... » read more

Streamlining Failure Analysis Of Chips


Experts at the Table: Semiconductor Engineering sat down to discuss how increasing complexity in semiconductor and packaging technology is driving shifts in failure analysis methods, with Frank Chen, director of applications and product management at Bruker Nano Surfaces & Metrology; Mike McIntyre, director of product management in the Enterprise Business Unit at Onto Innovation; Kamran Hak... » read more

Die-To-Die Security


Security concerns are growing as more chiplets or die are added into a package. There are more possible attack points, and data is becoming increasingly valuable, which makes a successful attack much more lucrative than in the past. Mike Borza, Synopsys scientist, talks about the impact of heterogeneous integration on security, what the risks are for multi-tenant data centers, and what happens ... » read more

Everyone’s A System Designer With Heterogeneous Integration


The move away from monolithic SoCs to heterogeneous chips and chiplets in a package is accelerating, setting in motion a broad shift in methodologies, collaborations, and design goals that are felt by engineers at every step of the flow, from design through manufacturing. Nearly every engineer is now working or touching some technology, process, or methodology that is new. And they are inter... » read more

Network-on-Chips Enabling Artificial Intelligence/Machine Learning Everywhere


Recently, I attended the AI HW Summit in Santa Clara and Autosens in Brussels. Artificial intelligence and machine learning (AI/ML) were critical themes for both events, albeit from different angles. While AI/ML as a buzzword is very popular these days in all its good and bad ways, in discussions with customers and prospects, it became clear that we need to be precise in defining what type of A... » read more

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