tag: chiplets

A Chiplet-Based Fully Homomorphic Encryption Accelerator
By Technical Paper Link - 18 Aug, 2023 - Comments: 0

A technical paper titled “CiFHER: A Chiplet-Based FHE Accelerator with a Resizable Structure” was published by researchers at Seoul National University. Abstract: "Fully homomorphic encryption (FHE) is in the spotlight as a definitive solution for privacy, but the high computational overhead of FHE poses a challenge to its practical adoption. Although prior studies have attempted to desig... » read more

Who Will Regulate Data Exchanges In Chiplets?
By Ed Sperling - 17 Aug, 2023 - Comments: 0

Scaling is still important when it comes to logic and low power, but it's no longer the main avenue for improving performance. What used to be a single chip, comprised of various IP blocks and components on a single SoC, is giving way to a heterogeneous collection of chiplets — at least for the big chipmakers and system companies at the leading edge. Chiplets are currently the best solutio... » read more

Enabling A Chiplet Supply Chain
By Vik Chaudhry - 17 Aug, 2023 - Comments: 0

Chiplets have been in the news quite a bit lately. A chiplet-based architecture offers several advantages that chip designers can benefit from as they bring out new products to the market. Over the years, system designers have integrated more and more functions into a system on chip (SoC). As a result, the size of SoCs keeps increasing. Even though SoCs provide several advantages in performance... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 11 Aug, 2023 - Comments: 0

TSMC, Bosch, Infineon, and NXP will jointly invest in the European Semiconductor Manufacturing Co. (ESMC), in Dresden, Germany, to provide advanced semiconductor manufacturing services. ESMC marks a significant step toward construction of a 300mm fab, which is expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers on TSMC’s 28/22nm planar CMOS and 16/12nm finFET proce... » read more

A Performance-Aware Framework For Co-Optimizing Floorplan And Performance Of Chiplet-Based Architecture
By Technical Paper Link - 10 Aug, 2023 - Comments: 0

A technical paper titled “Floorplet: Performance-aware Floorplan Framework for Chiplet Integration” was published by researchers at Chinese University of Hong Kong and University of California Berkeley. Abstract: "A chiplet is an integrated circuit that encompasses a well-defined subset of an overall system's functionality. In contrast to traditional monolithic system-on-chips (SoCs),... » read more

A Search Framework That Optimizes Hybrid-Device IMC Architectures For DNNs, Using Chiplets
By Technical Paper Link - 08 Aug, 2023 - Comments: 0

A technical paper titled “HyDe: A Hybrid PCM/FeFET/SRAM Device-search for Optimizing Area and Energy-efficiencies in Analog IMC Platforms” was published by researchers at Yale University. Abstract: "Today, there are a plethora of In-Memory Computing (IMC) devices- SRAMs, PCMs & FeFETs, that emulate convolutions on crossbar-arrays with high throughput. Each IMC device offers its own pr... » read more

A Chiplet-Based FHE Accelerator Design Enabling Scalability And Higher Throughput
By Technical Paper Link - 07 Aug, 2023 - Comments: 0

A technical paper titled “REED: Chiplet-Based Scalable Hardware Accelerator for Fully Homomorphic Encryption” was published by researchers at Graz University of Technology and Samsung Advanced Institute of Technology. Abstract: "Fully Homomorphic Encryption (FHE) has emerged as a promising technology for processing encrypted data without the need for decryption. Despite its potential, its... » read more

Chiplets: Deep Dive Into Designing, Manufacturing, And Testing
By The SE Staff - 07 Aug, 2023 - Comments: 0

Chiplets are a disruptive technology. They change the way chips are designed, manufactured, tested, packaged, as well as the underlying business relationships and fundamentals. But they also open the door to vast new opportunities for existing chipmakers and startups to create highly customized components and systems for specific use cases and market segments. This LEGO-like approach sounds ... » read more

DAC 2023: Megatrends And The Road Ahead For Design Automation
By Frank Schirrmeister - 27 Jul, 2023 - Comments: 0

As Silicon Valley is in the midst of the heat wave the world is experiencing, the recent Design Automation Conference and its exhibition discussed hot technologies. Three megatrends defined the current situation – artificial intelligence (AI), chiplets, and integration. To me, the more exciting aspect of DAC was the discussion of what is ahead for EDA in the decade to come, and for that, the ... » read more

New Technology Accelerates Multi-Die System Simulation
By Taruna Reddy - 27 Jul, 2023 - Comments: 0

AI-powered chatbots. Robotic manufacturing equipment. Self-driving cars. Bandwidth-intensive applications like these are flourishing—and driving the move from monolithic system-on-chips (SoCs) to multi-die systems. By integrating multiple dies, or chiplets, into a single package, designers can achieve scaling of system functionality at reduced risk and with faster time to market. Multi-die... » read more

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