Changes In Formal Verification


For the better part of two decades, formal verification was considered too difficult to use in many designs and too slow for anything but narrow bug hunting. Much has changed recently. Ashish Darbari, CEO of Axiomise, explains why formal is now essential for finding deadlocks, security holes, and Xprop issues in mission-critical, safety-critical, and AI designs, and how that will apply to chipl... » read more

X-ray Inspection Becoming Essential In Advanced Packaging


X-ray technology is moving into the mainstream of chip manufacturing as complex assemblies and advanced packaging make it increasingly difficult to ensure these devices will work as expected throughout their lifecycles. A single defect in a chiplet or interconnect can transform a complex advanced package into expensive scrap, and the risk only increases as the chip industry shifts from homog... » read more

Navigating Chiplet-Based Automotive Electronics Design With Advanced Tools And Flows


In the rapidly evolving landscape of automotive electronics, traditional monolithic design approaches are giving way to something more flexible and powerful—chiplets. These modular microchips, which are themselves parts of a whole silicon system, offer unparalleled potential for improving system performance, reducing manufacturing costs, and accelerating time-to-market in the automotive secto... » read more

Moving Software-Defined Vehicles Forward


Experts at the Table: The automotive ecosystem is undergoing a transformation toward software-defined vehicles, spurring new architectures with more software. Semiconductor Engineering sat down to discuss the impact of these changes with Suraj Gajendra, vice president of products and solutions in Arm's automotive line of business; Chuck Alpert, R&D automotive fellow at Cadence; Steve Spadon... » read more

What’s Missing In Test


Experts at the Table: Semiconductor Engineering sat down to discuss how functional test content is brought up at first silicon, and the balance between ATE and system-level testing, with Klaus-Dieter Hilliges, V93000 platform extension manager at Advantest Europe; Robert Cavagnaro, fellow in the Design Engineering Group at Intel (responsible for manufacturing and test strategy of data center... » read more

When To Expect Domain-Specific AI Chips


The chip industry is moving toward domain-specific computation, while artificial intelligence (AI) is moving in the opposite direction, creating a gap that could force significant changes in how chips and systems are architected in the future. Behind this split is the amount of time it takes to design hardware and software. In the 18 months since ChatGPT was launched on the world, there has ... » read more

Probing Attacks Against Chiplets


A technical paper titled “Evaluating Vulnerability of Chiplet-Based Systems to Contactless Probing Techniques” was published by researchers at University of Massachusetts and Worcester Polytechnic Institute. Abstract: "Driven by a need for ever increasing chip performance and inclusion of innovative features, a growing number of semiconductor companies are opting for all-inclusive System-... » read more

Power-Aware Revolution In Automated Test For ICs


As semiconductor devices advance in complexity and sensitivity to power fluctuations, the integration of power-aware automatic test pattern generation (ATPG) is becoming indispensable for yield and the overall functionality of a chip. Unlike traditional ATPG, which generates test patterns solely to ensure device functionality, power-aware ATPG takes it a step further by meticulously consider... » read more

Adoption of Chiplet Technology in the Automotive Industry


A technical paper titled "Chiplets on Wheels: Review Paper on Holistic Chiplet Solutions for Autonomous Vehicles" was published by researchers at the Indian Institute of Technology, Madras. Abstract "On the advent of the slow death of Moore's law, the silicon industry is moving towards a new era of chiplets. The automotive industry is experiencing a profound transformation towards software-... » read more

Making Adaptive Test Work Better


One of the big challenges for IC test is making sense of mountains of data, a direct result of more features being packed onto a single die, or multiple chiplets being assembled into an advanced package. Collecting all that data through various agents and building models on the tester no longer makes sense for a couple reasons — there is too much data, and there are multiple customers using t... » read more

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