tag: chiplets

Security Risks Widen With Commercial Chiplets
By Ed Sperling - 07 Jul, 2022 - Comments: 0

The commercialization of chiplets is expected to increase the number and breadth of attack surfaces in electronic systems, making it harder to keep track of all the hardened IP jammed into a package and to verify its authenticity and robustness against hackers. Until now this has been largely a non-issue, because the only companies using chiplets today — AMD, Intel, and Marvell — interna... » read more

EDA Gaps At The Leading Edge
By Ed Sperling - 29 Jun, 2022 - Comments: 1

Semiconductor Engineering sat down to discuss why new approaches are required for heterogeneous designs, with Bari Biswas, senior vice president for the Silicon Realization Group at Synopsys; John Lee, general manager and vice president of the Ansys Semiconductor business unit; Michael Jackson, corporate vice president for R&D at Cadence; Prashant Varshney, head of product for Microsoft Azu... » read more

Week In Review: Manufacturing, Test
By Ed Sperling - 17 Jun, 2022 - Comments: 0

Node scaling wars are revving up, although much of the action is happening where most people can't see it — inside of research labs. This is difficult stuff, which makes delivery dates difficult to pinpoint, and no one wants to give away their competitive position or commit to a timeline they can't keep. Billions of dollars of leading-edge research — funded by pure-play foundry TSMC, IDM... » read more

Variation Making Trouble In Advanced Packages
By Ed Sperling - 16 Jun, 2022 - Comments: 2

Variation is becoming increasingly problematic as chip designs become more heterogeneous and targeted by application, making it difficult to identify the root cause of problems or predict what can go wrong and when. Concerns about variation traditionally have been confined to the most advanced nodes, where transistor density is highest and where manufacturing processes are still being fine-t... » read more

Can Analog Make A Comeback?
By Brian Bailey - 09 Jun, 2022 - Comments: 3

We live in an analog world dominated by digital processing, but that could change. Domain specificity, and the desire for greater levels of optimization, may provide analog compute with some significant advantages — and the possibility of a comeback. For the last four decades, the advantages of digital scaling and flexibility have pushed the dividing line between analog and digital closer ... » read more

IP Industry Transformation
By Brian Bailey - 09 Jun, 2022 - Comments: 0

The design IP industry is developing an assortment of new options and licensing schemes that could affect everything from how semiconductor companies collaborate to how ICs are designed, packaged, and brought to market. The IP market already has witnessed a sweeping shift from a "design once, use everywhere" approach, to an "architect once, customize everywhere" model, in which IP is highly ... » read more

Keeping IC Packages Cool
By Laura Peters and Karen Heyman - 07 Jun, 2022 - Comments: 0

Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost performance and reduce power, they are wrestling with a whole new set of heat-related issues. The shift to advanced packaging enables chipmakers to meet demands for increasing bandwidth, clock speeds, and power density for high perform... » read more

Who Benefits From Chiplets, And When
By Ed Sperling - 31 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss new packaging approaches and integration issues with Anirudh Devgan, president and CEO of Cadence; Joseph Sawicki, executive vice president of Siemens EDA; Niels Faché, vice president and general manager at Keysight; Simon Segars, advisor at Arm; and Aki Fujimura, chairman and CEO of D2S. This discussion was held in front of a... » read more

Standardizing Chiplet Interconnects
By John Koon - 23 May, 2022 - Comments: 0

The chip industry is making progress on standardizing the infrastructure for chiplets, setting the stage for faster and more predictable integration of different functions and features from different vendors. The ability to choose from a menu of small, highly specialized chips, and to mix and match them for specific applications and use cases, has been on the horizon for more than a decade. ... » read more

Bridging IC Design, Manufacturing, And In-Field Reliability
By Ed Sperling - 18 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about silicon lifecycle management and how that can potentially glue together design, manufacturing, and devices in the field, with Prashant Goteti, principal engineer at Intel; Rob Aitken, R&D fellow at Arm; Zoe Conroy, principal hardware engineer at Cisco; Subhasish Mitra, professor of electrical engineering and computer sci... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy