Week In Review: Semiconductor Manufacturing, Test

By Susan Rambo - 30 Jun, 2023 - Comments: 0

Restrictions on China continue to grow. The Biden Administration is considering more restrictions on selling advanced AI chips to China, according to multiple media reports. Meanwhile, the Dutch government is expected to limit the sale of manufacturing equipment. JIC Capital, the wholly owned subsidiary of Japan Investment Corporation (JIC), will purchase materials company JSR Corp. through ... » read more

Chip Industry’s Technical Paper Roundup: May 16

By Linda Christensen - 16 May, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=103 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us... » read more

The Degradation of Li-ion Batteries: A Review

By Technical Paper Link - 08 May, 2023 - Comments: 0

A technical paper titled "Battery Degradation in Electric and Hybrid Electric Vehicles: A Survey Study" was published by researchers at Clemson University and Operation Technology Inc. Abstract (partial) "This paper explains the detailed degradation mechanism inside the battery first. Then, the major factors responsible for the degradation and their effects on the battery during the operati... » read more

Technical Paper Round-up: April 26

By Linda Christensen - 26 Apr, 2022 - Comments: 0

Find all technical papers in Semiconductor Engineering’s library. [table id=23 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a ... » read more

van der Waals Semiconductor Empowered Vertical Color Sensor

By Technical Paper Link - 20 Apr, 2022 - Comments: 0

Abstract "Biomimetic artificial vision is receiving significant attention nowadays, particularly for the development of neuromorphic electronic devices, artificial intelligence, and microrobotics. Nevertheless, color recognition, the most critical vision function, is missed in the current research due to the difficulty of downscaling of the prevailing color sensing devices. Conventional colo... » read more

Auto Chip Test Getting Harder

By Kevin Fogarty - 06 Aug, 2018 - Comments: 3

Chipmakers and test/validation companies are helping lead the effort to develop self-driving cars, but they are facing a wide range of technical and even cultural barriers. Advanced driver assist systems (ADAS) already are the most complex systems by far in modern cars, the best of which hover between Level 2 and Level 3 on the five-step autonomy ladder maintained by the Society of Automotiv... » read more

Power/Performance Bits: Feb. 20

By Jesse Allen - 20 Feb, 2018 - Comments: 0

Wireless TENG Researchers at Clemson University developed a wireless triboelectric nanogenerator, or W-TENG, that can also act as a battery-free remote. The key to triboelectric nanogenerators is using materials that are opposite in their affinity for electrons so they generate a voltage when brought in contact with each other. For the W-TENG, one electrode was constructed of a multipart... » read more

Power/Performance Bits: Jan. 5

By Jesse Allen - 05 Jan, 2016 - Comments: 0

A foggy consortium Scientists at Princeton University, ARM, Cisco, Dell, Intel, and Microsoft formed a global effort to develop architectures and tools to further "fog computing" and networks, which aim to harness connected devices' own computing, sensing and storage power to form edge networks that meet most of the demand of user devices that are at the periphery of a more centralized netwo... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Clemson University