tag: co-packaged optics

Silicon Photonics Raises New Test Challenges
By Jeorge Hurtarte - 11 Mar, 2025 - Comments: 0

Semiconductor devices continuously experience advancements leading to technology and innovation leaps, such as we see today for applications in AI high-performance computing for data centers, edge AI devices, electric vehicles, autonomous driving, mobile phones, and others. Recent technology innovations include Angstrom-scale semiconductor processing nodes, high-bandwidth memory, advanced 2.5D/... » read more

Advanced Packaging Evolution: Chiplet And Silicon Photonics-CPO
By Vincent Lin - 20 Feb, 2025 - Comments: 0

As we enter the AI era, the demand for enhanced connectivity in cloud services and AI computing continues to surge. With Moore’s Law slowing down, the increasing data rate requirements are surpassing the advancements of any single semiconductor technology. This shift underscores the importance of heterogeneous integration (HI) as a crucial solution for alleviating bandwidth bottlenecks. Tod... » read more

Why HPC Chip Designers Are Looking Into Linear Pluggable Optics
By Synopsys - 12 Feb, 2025 - Comments: 0

This paper delves into the technical complexities and emerging trends in integrating linear pluggable optics within AI chip design. The rapid growth of hyperscale data centers, driven by the demands of LLMs and transformative AI applications, requires innovative solutions optimized for power, latency, and bandwidth. Emerging industry standards are ensuring interoperability between independently... » read more

Co-Packaged Optics To Train/Run GenAI Models in Data Centers (IBM)
By Technical Paper Link - 27 Dec, 2024 - Comments: 0

A new technical paper titled "Next generation Co-Packaged Optics Technology to Train & Run Generative AI Models in Data Centers and Other Computing Applications" was published by researchers at IBM. Abstract "We report on the successful design and fabrication of optical modules using a 50 micron pitch polymer waveguide interface, integrated for low loss, high density optical data transf... » read more

Next-Gen High-Speed Communication In Data Centers
By Ed Sperling - 21 Aug, 2024 - Comments: 0

Data centers are being flooded with data. While more of it needs to be processed locally, much of it also needs to be moved around within a system and between systems. This has put a spotlight on a variety of new optical technologies and methodologies. Yang Zhang, senior product marketing manager at Cadence, talks about the rapid increase in different types of optics and optical scenarios being... » read more

Linear Drive Optics May Reduce Data Latency
By Karen Heyman - 11 Apr, 2024 - Comments: 0

Optical and electrical are starting to cross paths at a much deeper level, particularly with the growing focus on 3D-ICs and AI/ML training in data centers, driving changes both in how chips are designed and how these very different technologies are integrated together. At the root of this shift are the power and performance demands of AI/ML. It can now take several buildings of a data cente... » read more

Shedding More Light On Photonics For Multi-Die Systems
By Kenneth Larsen - 21 Dec, 2023 - Comments: 0

By Kenneth Larsen and Twan Korthorst Photonics harness the speed of light for fast, low-power, high-capacity data transfer. A tremendous amount of data needs to be moved swiftly across different components in a multi-die system. Considering this, exploiting the advantages of light is one way to mitigate heat dissipation and energy consumption concerns while delivering fast data transmission.... » read more

New Standards Push Co-Packaged Optics
By Karen Heyman - 26 Apr, 2023 - Comments: 0

Co-packaged optics (CPOs) promise five times the bandwidth of pluggable connections, but the new architecture requires multiple changes to accommodate different applications. The Optical Internetworking Forum (OIF) recently published standards for co-packaged optics, which are the photonic industry’s hope for handling today’s faster Ethernet interfaces, as well as increasing speeds and p... » read more

Tech Forecast: Fab Processes To Watch Through 2040
By Laura Peters - 16 Mar, 2023 - Comments: 0

The massive proliferation of semiconductors in more markets, and more applications within those markets, is expected to propel the industry to more than $1 trillion by 2030. But over the next 17 years, semiconductors will reach well beyond the numbers, changing the way people work, how they communicate, and how they measure and monitor their health and well-being. Chips will be the enabling ... » read more

Co-Packaged Optics In The Data Center
By Ed Sperling - 08 Jun, 2022 - Comments: 0

Just because faster Ethernet is added to the data center doesn’t mean existing hardware can utilize it efficiently. Scott Durrant, strategic marketing manager at Synopsys, talks with Semiconductor Engineering about the rapid rollout of faster Ethernet rates, problems in moving data to the front module of the switch and how much energy is required, and what optical technology can bring to the ... » read more

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