tag: co-packaged optics

Testing At The Speed Of Light: Enabling Scalable Optical Testing For Silicon Photonics And CPO
By Matthew Griffin - 10 Jul, 2025 - Comments: 0

Today, a single ChatGPT query consumes roughly ten times more power than a traditional Google search and will only continue to grow as AI extends to image and video generation. With this growth not only in AI, but also in cloud computing and high-performance computing (HPC), data center electricity consumption is projected to account for up to 9.1% of total U.S. electricity use by 2030. ... » read more

Novel Assembly Approaches For 3D Device Stacks
By Laura Peters - 30 Jun, 2025 - Comments: 0

The next big leap in semiconductor packaging will require a slew of new technologies, processes, and materials, but collectively they will enable orders of magnitude improvement in performance that will be essential for the AI age. Not all of these issues are fully solved but the recent Electronic Components Technology Conference (ECTC) provided a glimpse into the huge leaps in progress that... » read more

Integration of High-Density Polymer Waveguides With Silicon Photonics for CPO (imec, Ghent)
By Technical Paper Link - 03 Jun, 2025 - Comments: 0

A technical paper titled "Low-Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics" was published by researchers at imec and Ghent University. Abstract "Co-Packaged Optics applications require scalable and high-yield optical interfacing solutions to silicon photonic chiplets, offering low-loss, broadband, and polarization-independent optical coup... » read more

On The Ground At ECTC 2025
By Gregory Haley - 02 Jun, 2025 - Comments: 0

Senior Executive Editor Laura Peters examines the the hot topics at last week's IEEE's Electronic Components and Technology Conference, including the impact of hardware-software integration on power consumption, co-packaged optics, hybrid bonding, and fan-out panel-level packaging. https://youtu.be/yBDKqrPQBl4   » read more

Co-Packaged Optics Reaches Power Efficiency Tipping Point
By Laura Peters - 02 Jun, 2025 - Comments: 0

Commercialization has started for network switches based on co-packaged optics (CPO), which are capable of routing signals at terabits per second speeds, but manufacturing challenges remain regarding fiber-to-photonic IC alignment, thermal mitigation, and optical testing strategies. By moving the optical-to-electronic data conversion as close as possible to the GPU/ASIC switch in data center... » read more

Optimizing Data Movement
By Ann Mutschler - 29 May, 2025 - Comments: 1

Demand for new and better AI models is creating an insatiable demand for more processing power and much better data throughput, but it's also creating a slew of new challenges for which there are not always good solutions. The key here is figuring out where bottlenecks might crop up in complex chips and advanced packages. This involves a clear understanding of how much bandwidth is required ... » read more

Three-Way Race To 3D-ICs
By Ed Sperling - 05 May, 2025 - Comments: 1

Intel Foundry, TSMC, and Samsung Foundry are scrambling to deliver all the foundational components of full 3D-ICs, which collectively will deliver orders of magnitude improvements in performance with minimal power sometime within the next few years. Much attention has been focused on process node advances, but a successful 3D-IC implementation is much more complex and comprehensive than just... » read more

Silicon Photonics Raises New Test Challenges
By Jeorge Hurtarte - 11 Mar, 2025 - Comments: 0

Semiconductor devices continuously experience advancements leading to technology and innovation leaps, such as we see today for applications in AI high-performance computing for data centers, edge AI devices, electric vehicles, autonomous driving, mobile phones, and others. Recent technology innovations include Angstrom-scale semiconductor processing nodes, high-bandwidth memory, advanced 2.5D/... » read more

Advanced Packaging Evolution: Chiplet And Silicon Photonics-CPO
By Vincent Lin - 20 Feb, 2025 - Comments: 0

As we enter the AI era, the demand for enhanced connectivity in cloud services and AI computing continues to surge. With Moore’s Law slowing down, the increasing data rate requirements are surpassing the advancements of any single semiconductor technology. This shift underscores the importance of heterogeneous integration (HI) as a crucial solution for alleviating bandwidth bottlenecks. Tod... » read more

Why HPC Chip Designers Are Looking Into Linear Pluggable Optics
By Synopsys - 12 Feb, 2025 - Comments: 0

This paper delves into the technical complexities and emerging trends in integrating linear pluggable optics within AI chip design. The rapid growth of hyperscale data centers, driven by the demands of LLMs and transformative AI applications, requires innovative solutions optimized for power, latency, and bandwidth. Emerging industry standards are ensuring interoperability between independently... » read more

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