tag: co-packaged optics

Making On-Chip Photonics Manufacturable
By Gregory Haley - 18 Jun, 2026 - Comments: 0

Key Takeaways: System-level energy and bandwidth pressures are pulling optics into the package faster than the manufacturing flow can mature. Photonics combines front-end fabrication, materials, thermal, cleanliness, and test into one problem that can’t be solved domain by domain. Test is moving upstream because discovering an optical failure after final assembly forfeits every goo... » read more

Building A Production-Ready Optically Connected Rack For AI Scale-Up
By Nandita Aggarwal - 11 Jun, 2026 - Comments: 0

By Nandita Aggarwal and Nicholas Chang As AI models drive compute demand, servers keep getting bigger. Rack‑scale AI systems (such as the 72-GPU systems from NVIDIA or AMD) enable many GPUs to work together through system-level optimization. They push beyond the limits of single-chip performance and meet the soaring compute needs of the AI era. But this is just the beginning. The next s... » read more

CPO Will Dominate Scale-Up: Link Budgets For dB And $ Are Key
By Geoff Tate - 10 Jun, 2026 - Comments: 0

In the next five years, scale-up interconnects will transition from copper to optical interconnects — primarily co-packaged optics (CPO), with some near-packaged optics (NPO), and perhaps some vertical-cavitity-surface-emitting lasers (VCSELs). The demand for AI has become visibly real with Anthropic hitting a $47 billion annual run rate, followed closely by OpenAI and Google Gemini. Anthr... » read more

Why Analog And Mixed-Signal Chips Resist Adaptive Test
By Gregory Haley - 09 Jun, 2026 - Comments: 0

Key Takeaways Analog and mixed-signal test remains heavily specification-based because the measurements do not always produce a single expected result. The absence of objective coverage metrics has historically encouraged conservative test flows, which IEEE 2427-2025 begins to address. Separating device behavior from test-path variation is a prerequisite for any adaptive flow—and h... » read more

Co-Packaged Optics Testing Faces Steep Data Center Ramp
By Anne Meixner - 09 Jun, 2026 - Comments: 0

Key Takeaways: Device interface board must balance flexibility in handling with customization for different optical connectors. Test fixtures should account for DUT socketing challenges, such as warpage, coupling, and interference. Advanced data management practices will help speed yield learning. Integrating photonic and electrical ICs into co-packaged optics (CPO) requires... » read more

Packaging Technologies Redefine AI And HPC Scalability Limits At ECTC 2026
By Lori Scott - 05 Jun, 2026 - Comments: 0

The 2026 IEEE Electronic Components and Technology Conference (ECTC) showcased how advanced packaging can redefine the scalability limits of artificial intelligence (AI) and high-performance computing (HPC). Across 20 technical papers, Intel Foundry engineers and collaborators highlighted breakthrough innovations — from Embedded Multi-die Interconnect Bridge-T (EMIB-T) enabling large multi-d... » read more

Lasers Are The Heartbeat Of The Optical AI Data Center
By Geoff Tate - 13 May, 2026 - Comments: 0

Last month we discussed how all interconnects will be optical in the data center in five years, but that's only part of the story. Every optical interconnect needs a laser. The laser provides the carrier, which is modulated and manipulated by the transmitter optical engine through fibers and connectors to the receiver optical engine. Each fiber, connector, and photonics device that the laser... » read more

Silicon Photonics Lights The Way To More Efficient Data Centers
By Katherine Derbyshire - 16 Apr, 2026 - Comments: 0

Key Takeaways Photonic interconnects potentially increase bandwidth density while significantly reducing power consumption. AI workloads are driving their adoption in data centers. On the other hand, photonic interconnects require a variety of different materials, introducing process compatibility and thermal and mechanical stress issues. Integrated electro-optical I/O modules are th... » read more

The Specialty Device Surge Part 2: The Process Control Challenges Of MEMS, Co-Packaged Optics, And More
By Christopher Haire - 07 Apr, 2026 - Comments: 0

In a world where high-bandwidth memory, GPUs, and advanced AI packages are all the rage, it is easy to forget the important role specialty devices play. These unsung heroes of modern life perform critical functions across a wide range of industries, including automotive, telecommunications, data centers, emerging AI hardware ecosystems, and consumer electronics, just like the smartphone in your... » read more

AI data Center Providers Seek Power and Bandwidth Promise in CPO
By Teradyne - 07 Apr, 2026 - Comments: 0

Co-packaged optics (CPO), a high-speed networking technology that integrates optical components (lasers, photodetectors) directly with switch/compute chips (ASICs) in the same package, continues to show promise. Advocates of CPO maintain that it reduces power consumption by over 80% and increases bandwidth density by shortening electrical traces to millimeters. Used primarily in data cente... » read more

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