Moving Software-Defined Vehicles Forward

By Ann Mutschler - 26 Jun, 2024 - Comments: 0

Experts at the Table: The automotive ecosystem is undergoing a transformation toward software-defined vehicles, spurring new architectures with more software. Semiconductor Engineering sat down to discuss the impact of these changes with Suraj Gajendra, vice president of products and solutions in Arm's automotive line of business; Chuck Alpert, R&D automotive fellow at Cadence; Steve Spadon... » read more

How Software Can Help Redefine Semiconductor Validation

By Jake Azbell - 11 Jul, 2023 - Comments: 0

The rate of technological advancement is increasing faster than ever before. Although the demands for meeting aggressive time-to-market requirements and innovating at warp speed are not new, they are continuing to accelerate. To cut costs without compromising product quality, engineers are now expected to test new designs more rapidly at various stages of development. Even though many organizat... » read more

Big Changes Ahead For Chip Technology And Industry Dynamics

By Ed Sperling - 08 Feb, 2023 - Comments: 0

Semiconductor Engineering sat down to discuss the impact of customization and advanced packaging, and concerns about reliability and geopolitical rivalries with Martin van den Brink, president and CTO of ASML; Luc Van den Hove, CEO of imec; David Fried, vice president of computational products at Lam Research; and Ankur Gupta, vice president and general manager of the test group and lifecycle s... » read more

Collaboration Widens Among Big Chip Companies

By Ed Sperling - 23 Jan, 2023 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss the growing need for collaboration among equipment and tools vendors, the impact of systems companies and increases in complexity, and how to handle a push for more customization while controlling costs, with Martin van den Brink, president and CTO of ASML; Luc Van den Hove, CEO of imec; David Fried, vice president of computati... » read more

Connecting Teams With A Collaboration Hub In The Cloud

By Siemens EDA - 25 Aug, 2021 - Comments: 0

Given the complexities inherent in both next-generation products and the underlying components used, effective collaboration is fundamental to successfully navigating the product creation journey. Teams that are better synchronized and aligned are far more likely to deliver a successful product to market on time and on budget. Explore how the Connect application extends the power of PADS Pro... » read more

Joining Hands In The Semiconductor Industry

By Ajit Manocha - 19 Apr, 2018 - Comments: 0

SEMI’s mantra is: Connect, Collaborate, Innovate. This mantra has delivered industry-enabling value to our members since SEMI’s beginnings in 1970. It has been essential for SEMI members to grow and prosper locally, while being synchronized globally. As the electronics manufacturing business has become more complex and interdependent, SEMI’s mantra has increasingly been applied across the... » read more

SOS Collaboration Platform: Powering The Next Discoveries In Physics

By Ranjit Adhikary - 03 Aug, 2017 - Comments: 0

The world is on the cusp of some of the greatest scientific breakthroughs in human history. The experiments physicists are carrying out today will shed new light on how our universe works. The Large Hadron Collider (LHC), a $10 billion project, unleashed a new perspective of how our universe works by letting us take a look at how tiny particles interact. You can forgive the physicists workin... » read more

Advanced ASICs Are A Team Sport

By Mike Gianfagna - 23 Feb, 2017 - Comments: 0

The recent Super Bowl proved that a team with conviction and focus can do anything. This notion comes in handy when you think about the nearly impossible job of designing and manufacturing an advanced ASIC – in finFET technologies, with an interposer, multiple die, and never-before-proven throughput rates. For these kind of advanced technologies, it does take a village. What works is open, tr... » read more

Avoiding The Barriers For Multi-Board Systems Design Development

By Dave Wiens - 22 Nov, 2016 - Comments: 0

Designing electronic systems that comprise multiple interacting boards, connectors and cables requires a multi-discipline team collaboration to effectively manage design complexity for optimum product performance and reliability. Multi-board systems may comprise two boards or up to hundreds of boards, packing a cabinet or rack, with interconnected connectors and/or cables. Since the hardware fu... » read more

DAC Day Two: Down To Business

By Brian Bailey - 07 Jun, 2016 - Comments: 0

DAC day two started with a breakfast presentation put on by Synopsys which included guests from ARM, TSMC and HiSilicon. It was titled Collaborating to Enable Design with the latest processors and finFET processes. Collaboration is a word that we hear increasingly when talking about the advanced nodes and today we are truly at the point where one company cannot do it all. Ron Moore, VP of ma... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?