tag: Cray

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 16 Nov, 2018 - Comments: 0

Internet of Things Gartner identified what it says are the top 10 strategic Internet of Things technologies and trends. Number one, no surprise, is artificial intelligence. Nick Jones, research vice president at Gartner, said in a statement, “AI will be applied to a wide range of IoT information, including video, still images, speech, network traffic activity, and sensor data.” Other top t... » read more

The Week In Review: Design
By Jesse Allen - 18 Nov, 2016 - Comments: 0

M&A Siemens plans to buy Mentor Graphics for $4.5 billion in cash. The move, if approved by regulators, would greatly expand Siemens’ capabilities in multi-physics design and embedded software for everything from semiconductors to automotive wiring harnesses. The transaction is expected to close in the second quarter of 2017. Tools Mentor Graphics uncorked a new product to measur... » read more

Manufacturing Bits: Nov. 17
By Mark LaPedus - 17 Nov, 2015 - Comments: 0

Speedy nano-scale subs For years, researchers have been developing nano-scale submarines. In theory, nano-subs could be used in various applications. For example, they could navigate inside the human body and transport medicine to various organs. The problem? Most nano-subs use or generate toxic chemicals, according to researchers from Rice University. Seeking to solve the problem, Rice ... » read more

The Week In Review: Design/IoT
By Ed Sperling - 11 Sep, 2015 - Comments: 0

Tools Mentor Graphics rolled out a new version of its tool for transferring PCB designs into data for fabrication, assembly and test. The company also announced that its debug environment will support the UPF Low Power Successive Refinement Methodology. Deals Ansys and Cray are claiming the world's record for simulation by scaling 129,000 cores. That's about 4X the previous record.  Ansys... » read more

Multi-Die Packaging Gains Steam
By Si2 - 06 Oct, 2014 - Comments: 0

By Herb Reiter Many readers will be familiar with my extensive background and focus in the emerging field of 3D IC technology, including both 3D stacked die and 2.5 interposer design flows. Now, I am excited to bring my expertise and passion to Silicon Integration Initiative (Si2), where I am now Director of 3D Programs, helping Si2’s members in the Open3D Technical Advisory Board develop pr... » read more

The Week In Review: Design
By Ed Sperling - 27 Jun, 2014 - Comments: 0

Tools eSilicon uncorked a GDSII online quote system for TSMC, which allows chipmakers to pick a variety of information ranging from process technology to package to yield and tapeout and production forecast and get a quote within minutes. This is a new twist in the value chain provider market. Synopsys added program to speed up FPGA-based prototype creation, which includes approved third-pa... » read more

Fastest Computers On The Planet
By Barry Pangrle - 05 Dec, 2013 - Comments: 0

The latest Green500 list (Excel spreadsheet here) was just released at the end of last month and heterogeneous systems now own the top of the list. The Top 10 systems all use a combination of Intel Xeon (mostly E5) processors paired with NVIDIA K20s. There are now 6 systems listed that have broken the 3,000 MFLOPS/W barrier and TSUBAME-KFC, belonging to the Tokyo Institute of Technology’s GSI... » read more

Shaking Up The Green500
By Barry Pangrle - 17 Jan, 2013 - Comments: 0

Barry Pangrle Last September, I wrote about the efficiency of IBM’s Power7+ architecture in my blog. IBM’s Sequoia supercomputer (a BlueGene/Q system) this past June had just shot to the top of the Supercomputing Top500 chart, clocking in at 16.32 petaflop/s on the Linpack benchmark. Other systems built around the IBM BlueGene/Q, Power BQC 16C 1.60GHz, Custom were also dominating the top o... » read more

Server Processor War Heats Up
By Kurt Shuler - 26 Apr, 2012 - Comments: 0

By Kurt Shuler Yesterday’s announcement that Intel will acquire Cray’s interconnect hardware program, including IP and 74 employees, is the latest salvo in the race to develop commercially viable massively multicore server processors. On the surface, this acquisition seems like another instance of Intel beefing up its board-level interconnect technology, after having already acquired Fu... » read more

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