Blog Review: Nov. 18

By Jesse Allen - 18 Nov, 2020 - Comments: 0

Arm's Roberto Lopez Mendez finds that holographic displays can now be achieved on mobile processors thanks to recent algorithmic and computational advances. Mentor's Colin Walls examines the reasons the consolidate a number of automotive sub-systems onto a smaller number of powerful ECU to reduce complexity and increase system reliability. Cadence's Paul McLellan takes a look at the devel... » read more

Blog Review: Nov. 4

By Jesse Allen - 04 Nov, 2020 - Comments: 0

Arm's Joshua Sowerby points to how to improve machine learning performance on mobile devices by using smart pruning to remove convolution filters from a network, reducing its size, complexity, and memory footprint. Mentor's Neil Johnson checks out how designers can write and verify RTL real-time using formal property checking in the style of test-driven development and why to give it a try. ... » read more

A Mid-Year End Market Recovery For Semiconductors

By Walt Custer - 17 Sep, 2020 - Comments: 0

Although the semiconductor chip and capital equipment markets performed well in the first half of 2020, many of the electronic equipment end markets struggled globally. World electronic equipment sales declined almost 10% in 2Q’20 vs. 2Q’19 (chart 1). Better mid-year end market demand However, world business conditions are improving. The global purchasing managers index, a measure of broa... » read more

Blog Review: Sept. 16

By Jesse Allen - 16 Sep, 2020 - Comments: 0

Cadence's Paul McLellan checks out what's new for TSMC's advanced packaging solutions and the ultra-low power, RF, eNVM, and CMOS image sensor specialty processes. Mentor's Ron Press points to an automated solution to measuring pattern value that provides a consistent, “apples to apples” assessment of patterns detecting defects based on the likelihood the physical defects occurring. S... » read more

Semiconductors Up Globally, Warnings Ahead

By Walt Custer - 20 Aug, 2020 - Comments: 0

Things are picking up. Purchasing managers indices indicated July manufacturing increases in most key countries with only South Korea and Japan having PMIs still in contraction territory (chart 1). The Global PMI recovered sharply (chart 2), reaching 50.3 in July. Service sector still fighting pandemic The manufacturing sector is recovering but the service sector is still struggling, hit h... » read more

Blog Review: July 29

By Jesse Allen - 29 Jul, 2020 - Comments: 0

Rambus' Scott Best digs into low-cost attacks against security chips that are often used to gauge how resistant and well-designed they are and defensive countermeasures that can be taken. Mentor's Colin Walls urges embedded developers to put a priority on writing clear, maintainable code and considers when using a higher level language like C++ may be helpful. Synopsys' Scott Knowlton fin... » read more

Blog Review: June 30

By Jesse Allen - 30 Jun, 2020 - Comments: 0

Cadence's Paul McLellan examines Fully Homomorphic Encryption, which allows for operations to be performed on encrypted data without decrypting it, and why it's now entering the realm of practicality. Mentor's Shivani Joshi explains the basics of using keepouts to prevent the placement of specific or all design items within a specified area and why they can make or break a first pass at crea... » read more

Blog Review: March 25

By Jesse Allen - 25 Mar, 2020 - Comments: 0

Rambus' Steven Woo checks out common memory systems that are used in the highest performance AI applications and points to the differences between on-chip memory, HBM, and GDDR. Mentor's Colin Walls considers whether software for embedded systems should be delivered as a binary library or source code and warns of some key potential issues when requesting source code. A Synopsys writer poi... » read more

Impact Of Coronavirus Could Threaten Global Electronics Growth

By Walt Custer - 20 Feb, 2020 - Comments: 0

Data through December showed a steady recovery in the global electronic supply chain with SEMI equipment leading the way in 3/12 growth (Chart 1). The global purchasing managers index moved into expansion territory (PMI>50) in January indicating accelerating growth in world manufacturing activity (Chart 2). But in late January the Coronavirus (COVID-19) began to make its negative impact f... » read more

Blog Review: Nov. 27

By Jesse Allen - 27 Nov, 2019 - Comments: 0

Arm's Ben Fletcher digs into what's needed to make wireless 3D integration a reality from a tool to automate the design and optimization process for inductors used in wireless 3D-ICs to exploring how the data can be encoded in the transceiver to reduce power consumption. Cadence's Paul McLellan listens in as Eli Singerman of Intel explains the importance of platform security and why firmware... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Custer Consulting