tag: CVD

Flash Dance For Inspection And Metrology
By Mark LaPedus - 16 Apr, 2015 - Comments: 0

Chipmakers are moving from planar technology to an assortment of 3D-like architectures, such as 3D NAND and finFETs For these devices, chipmakers face a multitude of challenges in the fab. But one surprising and oft-forgotten technology is emerging as perhaps the biggest challenge in both logic and memory—process control. Process control includes metrology and wafer inspection. Metrolo... » read more

How To Deal With Electromigration
By Katherine Derbyshire - 02 Mar, 2015 - Comments: 8

The replacement of aluminum with copper interconnect wiring, first demonstrated by IBM in 1997, brought the integrated circuit industry substantial improvements in both resistance to electromigration and line conductivity. Copper is both a better and more stable conductor than aluminum. Difficult though the transition was, it helped extend device scaling for another eighteen years (and counting... » read more

3D NAND Market Heats Up
By Mark LaPedus - 19 Feb, 2015 - Comments: 4

After some delays and uncertainty in past years, the 3D NAND market is finally heating up. In 2013 and 2014, Samsung was the only vendor participating in the 3D NAND market. Most other suppliers were supposed to ship 3D NAND devices in volumes last year, but vendors pushed out their production dates for various business and technical reasons. Going into 2015, [getentity id="22865" e_nam... » read more

Has 3D NAND Fallen Flat?
By Mark LaPedus - 17 Jul, 2014 - Comments: 0

Today’s planar NAND technology will hit the wall at 10nm, prompting the need for the next big thing in flash memory—3D NAND. In fact, 3D NAND may extend NAND flash memory for the next several years and enable new applications. And it will also drive a new wave of fabs and tool orders. But the transition won’t be as smooth as previous rollouts. 3D NAND is harder to manufacture than pr... » read more

New Materials Era In Advanced Interconnects
By Kavita Shah - 15 May, 2014 - Comments: 0

By Kavita Shah Growth in semiconductors today is driven primarily by mobile applications and this demand continues to increase with no slowdown in sight. Supporting this trend, chipmakers continue adding smaller and faster transistors to chips to maintain the pace of Moore’s Law, and as a consequence copper wiring is being drastically scaled and densities increased. Today advanced chips c... » read more

Manufacturing Bits: Dec. 3
By Mark LaPedus - 03 Dec, 2013 - Comments: 0

Animal robots invade London The London Science Museum will premiere U-CAT, an underwater robot turtle designed to penetrate shipwrecks. In the exhibit, the museum will also showcase several robots that resemble an eel, bat, cheetah cub, tumbleweed, tuna, salamander and other creatures. Meanwhile, built by the Centre for Biorobotics at Tallinn University of Technology, U-CAT’s locomotio... » read more

Applied To Buy TEL
By Mark LaPedus - 24 Sep, 2013 - Comments: 0

In a deal that could shake-up the fab tool landscape, Applied Materials has announced a definitive agreement to acquire rival Tokyo Electron Ltd. (TEL) in a stock deal valued at around $9.3 billion. Under the terms of the blockbuster deal, Applied Materials will own approximately 68% of the new company and TEL will own about 32%.  The combined entities will have a new name, dual headquarter... » read more

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