tag: Cypress Semiconductor

Packaging Wars Begin
By Mark LaPedus - 26 Sep, 2016 - Comments: 1

The advanced IC-packaging market is turning into a high-stakes competitive battleground, as vendors ramp up the next wave of [getkc id="82" kc_name="2.5D"]/[getkc id="42" kc_name="3D"] technologies, high-density fan-out packages and others. At one time, the outsourced semiconductor assembly and test ([getkc id="83" comment="OSAT"]) vendors dominated and handled the chip-packaging requirement... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 12 Aug, 2016 - Comments: 0

Chipmakers At this week’s Flash Memory Summit, Samsung rolled out several new products, including its next-generation 3D NAND device and a solid-state drive (SSD) with capacities up to 32 terabytes. At the same time, Samsung introduced a new and high-performance SSD solution, dubbed the Z-SSD. Samsung’s Z-SSD shares the fundamental structure of V-NAND and has a unique circuit design and... » read more

The Week in Review: IoT
By Jeff Dorsch - 08 Jul, 2016 - Comments: 0

Networks The Netherlands and South Korea are both laying claim to installing the first nationwide Internet of Things networks in the world. In the Netherlands, KPN has connected the country with a low-power, wide-area network optimized for IoT. SK Telecom is serving Korea with coast-to-coast IoT coverage, and the Korean carrier plans to spend up to $86.8 million through the end of 2017 on upg... » read more

Designing SoCs For Hybrids
By Ann Mutschler - 04 Feb, 2016 - Comments: 0

Hybrid vehicle sales are growing, driven by a global concern for lower vehicle emissions and consumer demand for better economy. This has set off a rush by semiconductor companies to provide key components for those vehicles because they are much more reliant on electronics than regular gasoline-powered vehicles. But the changeover is not as straightforward as it might sound. Hybrid vehicles... » read more

Foundries Expand Planar Efforts
By Mark LaPedus - 18 Jun, 2015 - Comments: 0

Competition is heating up in the leading-edge foundry business, as vendors begin to ramp up their new 16nm/14nm finFET processes. But that’s not the only action in the foundry arena. They are also expanding their efforts in the leading-edge planar market by rolling out new 28nm and 22nm processes. On one front, TSMC is offering new 28nm variants, based on bulk CMOS technology. And on an... » read more

What’s Different At 16/14nm?
By Ed Sperling - 28 May, 2015 - Comments: 0

Will finFETs live up to their promise? It depends on whom you ask, when you ask that question, and the intended application of a design. But across the semiconductor industry, there is general agreement that it's getting easier to work at the most advanced nodes as tools and flows are better understood and overall experience increases. There is no question that [getkc id="185" kc_name="finFE... » read more

The Week In Review: Design/IoT
By Jesse Allen - 24 Apr, 2015 - Comments: 0

Mergers & Acquisitions Synopsys continued expansion into the software security market with the acquisition of Codenomicon. The Finnish company was in the headlines this time last year when it discovered the Heartbleed bug during product testing. Tools Mentor Graphics released Calibre xACT, a parasitic extraction platform which automatically optimizes extraction techniques based on ... » read more

Trouble Spots And Optimism For 2015
By Ed Sperling - 18 Dec, 2014 - Comments: 0

Most top executives in the semiconductor industry are bullish about 2015 and even beyond, particularly as the [getkc id="76" comment="Internet of Things"] begins to drive new markets and market mash-ups, and as more semiconductors find their way into markets such as automotive, health-care and manufacturing. But it's not an entirely rosy picture, and top executives point to potential trouble sp... » read more

5 Ways To Cut Power
By Ed Sperling - 16 Jun, 2011 - Comments: 0

By Ed Sperling Low energy consumption with minimal leakage has emerged as the most competitive element in an IC design, regardless of whether it involves a plug, a battery, or whether it’s powered by a gasoline engine. While components on an SoC aren’t always power-aware, they’ll have to be in the future as consumers focus first on energy efficiency. With rising fuel costs, a concern ... » read more

Making Sense Out Of Convergence
By Ed Sperling - 27 May, 2009 - Comments: 0

By Ed Sperling Technology convergence and market consolidation have always gone hand in hand, although not necessarily in ways everyone expects. The confluence of video and audio was first exhibited by AT&T at the 1964 World’s Fair. The rather crude videophone demonstration promised a future where people could actually see the person they were talking with. Fast forward 45 years and... » read more

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