tag: D2S

Executive Insight: Aki Fujimura
By Mark LaPedus - 16 Oct, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss photomask technology and lithography trends with Aki Fujimura, chairman and chief executive of D2S. SE: What are the big challenges that keep you awake at night? Fujimura: Mask technology, and the investments in the mask industry, are increasingly important. But so far, the investment dollars that the community is willing to spend on it isn’... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 19 Sep, 2014 - Comments: 0

Gartner predicts that by 2016 smartwatches will comprise about 40% of consumer wristworn devices. Gartner said that nine out of the top 10 smartphone vendors have entered the wearables market to date or are about to ship a first product, while a year ago only two vendors were in that space. The eBeam Initiative announced the completion of its third annual survey. In one of the highlights of ... » read more

2014 eBeam Survey Results
By eBeam Initiative - 18 Sep, 2014 - Comments: 0

An industry-wide poll highlights what the industry is thinking about EUV and mask writing at advanced nodes. To view the poll, click here. » read more

Survey: Optimism Up For Multi-beam
By Mark LaPedus - 16 Sep, 2014 - Comments: 0

The eBeam Initiative announced the completion of its third annual survey. In one of the highlights of the survey, a majority (58%) of respondents predict that multi-beam technology will be used in production by 2016 to address the critical problem of mask write times as the industry moves to smaller geometries. And according to the survey, skepticism of EUV lithography also increased comp... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 12 Sep, 2014 - Comments: 0

Front-end fab equipment spending is projected to increase by 20% in 2015 to $42 billion, according to SEMI. In 2015, equipment spending could mark a historical record high, surpassing the previous peak years of 2007 ($39 billion) and 2011 ($40 billion). In 2014, the report predicts growth of approximately 21% for front-end fab equipment spending, for total spending of $34.9 billion. SEMI rep... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 20 Jun, 2014 - Comments: 0

According to one analyst, the capital spending picture looks gloomy. “We expect finFET and 3D NAND to ramp over the next two years. However, foundry and memory customers are showing great restraint with respect to spending plans, limiting the rate of new node transitions and overall capex upside. In the near term, we see no evidence of meaningful equipment orders to support high-volume finFET... » read more

Multi-beam Sees The Light
By Mark LaPedus - 19 Jun, 2014 - Comments: 2

The multiple-beam electron-beam market is going in two separate directions at once. Multi-beam for photomask writing is set to take off. The other market--multi-beam for direct-write lithography applications—is still in the early stages and remains in flux. In the multi-beam direct-write segment, for example, multiple sources indicate that KLA-Tencor is exiting this market to focus on its ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 06 Jun, 2014 - Comments: 0

To help fab tool vendors, Imec has formally launched what it calls a “suppliers hub.” This program aims to offer an open R&D platform, which enables chip suppliers and tool makers to collaborate more deeply and in an earlier stage in the process. D2S has acquired the assets of Gauda, a developer of GPGPU-based computational lithography acceleration technology headquartered in Sunnyvale,... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 16 May, 2014 - Comments: 0

IC Insights has released its rankings of the Q1 ‘14 top 25 semiconductor suppliers. Outside of the top five spots, there were numerous changes. MediaTek jumped up four positions. Also, last year’s Micron/Elpida merger created a new giant semiconductor company with Micron’s sales expected to be over $17 billion this year. Toshiba will demolish the No. 2 semiconductor fabrication facilit... » read more

One-On-One: Linyong Pang
By Mark LaPedus - 12 May, 2014 - Comments: 1

Semiconductor Engineering sat down to discuss trends in the lithography and photomask business with Linyong “Leo” Pang, the new chief product officer and executive vice president at D2S, which focuses on model-based mask data preparation as well as other mask writing technologies. What follows are excerpts of that conversation. SE: Before you arrived at D2S you were at Luminescent, whic... » read more

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