Week In Review: Manufacturing, Test

By Karen Heyman - 19 Aug, 2022 - Comments: 0

The U.S. Commerce Department issued export controls on key technologies, including gallium oxide (Ga2O3) and diamond substrates, which are used at high voltages and temperatures, as well as EDA tools specifically developed for GAA FETs. It's not clear how this will impact EDA companies, because many of the tools that will be used for designing for GAA FETs already are in use today for finFETs. ... » read more

Week in Review: Auto, Security, Pervasive Computing

By Marie C. Baca - 19 Aug, 2022 - Comments: 0

Automotive and Mobility Lyft launched a new robotaxi service that operates on and around the Las Vegas Strip using the electric Ioniq 5 vehicle from Motional. Similar services by other companies are currently in use in a handful of other U.S. cities, including San Francisco and Phoenix. The new Lyft service currently requires the presence of safety drivers, though Lyft and Motional say it will... » read more

Week In Review: Design, Low Power

By Jesse Allen - 12 Aug, 2022 - Comments: 0

Infineon acquired Industrial Analytics, a provider of AI-enabled industrial equipment monitoring. Its solution can monitor plants for early detection of critical developments, based on analysis and evaluation of vibrations, and evaluate data for both predictive and prescriptive maintenance. "Industrial Analytics has outstanding expertise in the area of predictive analysis for industrial machine... » read more

Week In Review: Design, Low Power

By Jesse Allen - 17 Jun, 2022 - Comments: 0

Tools, design, chips Altair, a provider of software and cloud services for CAE, HPC, simulation, and data analysis, acquired Concept Engineering, a provider of automatic schematic generation tools, electronic circuit and wire harness visualization platforms that provide on-the-fly visual rendering, and electronic design debug solutions. “Concept Engineering’s advanced, reactive visualizati... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 27 May, 2022 - Comments: 0

Automotive, mobility Cadence is now an official technology partner of the McLaren Formula 1 Team. The team will use Cadence’s Fidelity CFD Software to look at the computational fluid dynamics (CFD) of the airflow around the race cars and predict how a car design will affect the airflow. Infineon uncorked its XENSIV 60 GHz automotive radar sensor for in-cabin monitoring systems. One use ca... » read more

A Methodology for Automatic eFPGA redaction

By Technical Paper Link - 20 May, 2022 - Comments: 0

New academic paper titled "ALICE: An Automatic Design Flow for eFPGA Redaction" from researchers at Politecnico di Milano, New York University, University of Calgary, and the University of Utah. Abstract "Fabricating an integrated circuit is becoming unaffordable for many semiconductor design houses. Outsourcing the fabrication to a third-party foundry requires methods to protect the intell... » read more

Data-driven RRAM device models using Kriging interpolation

By Technical Paper Link - 10 Apr, 2022 - Comments: 0

New technical paper from The George Washington University and NIST with support from DARPA and others. Abstract "A two-tier Kriging interpolation approach is proposed to model jump tables for resistive switches. Originally developed for mining and geostatistics, its locality of the calculation makes this approach particularly powerful for modeling electronic devices with complex behavior la... » read more

Chiplets Enter The Supercomputer Race

By Mark LaPedus - 17 Mar, 2022 - Comments: 0

Several entities from various nations are racing each other to deliver and deploy chiplet-based exascale supercomputers, a new class of systems that are 1,000x faster than today’s supercomputers. The latest exascale supercomputer CPU and GPU designs mix and match complex dies in advanced packages, adding a new level of flexibility and customization for supercomputers. For years, various na... » read more

Week In Review: Design, Low Power

By Jesse Allen - 25 Feb, 2022 - Comments: 0

Tools & IP Codasip debuted two new customizable low power embedded RISC-V processor cores. To support embedded AI applications, the L31/L11 cores run Google’s TensorFlowLite for Microcontrollers. Codasip Studio tools can be used to customize for specific system, software, and application requirements. Licensing the CodAL description of a Codasip RISC-V core grants customers a full archit... » read more

Design Challenges Increasing For Mixed-Die Packages

By Ann Mutschler - 09 Feb, 2022 - Comments: 0

The entire semiconductor ecosystem is starting to tackle a long list of technology and business changes that will be needed to continue scaling beyond Moore's Law, making heterogeneous combinations of die easier, cheaper, and more predictable. There are a number of benefits to mixing die and putting them together in a modular way. From a design standpoint, this approach provides access to th... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: DARPA

Week In Review: Manufacturing, Test

Week in Review: Auto, Security, Pervasive Computing

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing

A Methodology for Automatic eFPGA redaction

Data-driven RRAM device models using Kriging interpolation

Chiplets Enter The Supercomputer Race

Week In Review: Design, Low Power

Design Challenges Increasing For Mixed-Die Packages