Optimizing Data Center TCO With CXL And Compression


In the ever-evolving landscape of data centers, Total Cost of Ownership (TCO) remains a critical metric. It encompasses all costs associated with data center infrastructure throughout its lifecycle, including initial purchase, installation, utilization, maintenance, energy consumption, and eventual replacement. By understanding and optimizing TCO, hyperscalers can make informed decisions that e... » read more

Data Center Solutions: Reducing the Risk of Change


A panel of thermal and operational experts discuss the evolving challenges in the data center industry and the tools they’re using to overcome them. This eBook details the panel insights, which cover new applications, evolving thermal requirements, innovative cooling technology, and more. Download the eBook for a snapshot of how data center professionals are overcoming the current changes ... » read more

Why HPC Chip Designers Are Looking Into Linear Pluggable Optics


This paper delves into the technical complexities and emerging trends in integrating linear pluggable optics within AI chip design. The rapid growth of hyperscale data centers, driven by the demands of LLMs and transformative AI applications, requires innovative solutions optimized for power, latency, and bandwidth. Emerging industry standards are ensuring interoperability between independently... » read more

Silent Data Errors Still Slipping Through The Cracks


Silent data corruption errors in large server farms have become a major concern of cloud users, hyperscalers, processor manufacturers and the test community. Silent data errors (also called silent data corruption errors) are hardware errors that occur when an incorrect computational result from a processor core goes undetected by the system. The data is silently corrupted because neither sof... » read more

Chip Industry Week In Review


The chip industry is well on its way to hit $1 trillion in revenue by the end of its decade. Several analyst firms released 2024 annual results and 2025 predictions: Worldwide semiconductor revenue reached $626 billion in 2024, an 18% increase versus 2023, according to preliminary Gartner report. Memory revenue grew about 70%  2024 versus 2023. The firm forecasts that HBM will make up 19%... » read more

Gold In The Machine: Scaling Infrastructure For The Age Of AI


During the gold rush, hopeful prospectors flooded the west to make their fortunes in gold. Today, technology pioneers are looking to stake their claim in the realm of artificial intelligence (AI). Price Waterhouse Cooper (PWC) estimates that 45% of total global economic gains by 2030 will be driven by AI as more sectors embrace the productivity and product enhancement benefits of AI. PWC’s ... » read more

AI Infrastructure At A Crossroads


By Ramin Farjadrad and Syrus Ziai There is a big push to achieve greater scale, performance and sustainability to fuel the AI revolution. More speed, more memory bandwidth, less power — these are the holy grails. Naturally, the one-two punch of StarGate and DeepSeek last week has raised many questions in our ecosystem and with our various stakeholders. Can DeepSeek be real? And if so, w... » read more

Is Liquid Cooling The Future Of Your Data Center?


The data center industry is facing unprecedented challenges. With chip densities skyrocketing, high-performance computing is being pushed to its limits, all while energy costs are soaring and environmental concerns are escalating. Securing approvals for new data center facilities has become more complex, often plagued by community objections and grid supply issues. However, amidst these hurd... » read more

Co-Packaged Optics To Train/Run GenAI Models in Data Centers (IBM)


A new technical paper titled "Next generation Co-Packaged Optics Technology to Train & Run Generative AI Models in Data Centers and Other Computing Applications" was published by researchers at IBM. Abstract "We report on the successful design and fabrication of optical modules using a 50 micron pitch polymer waveguide interface, integrated for low loss, high density optical data transf... » read more

Integrating Ethernet, PCIe, And UCIe For Enhanced Bandwidth And Scalability For AI/HPC Chips


By Madhumita Sanyal and Aparna Tarde Multi-die architectures are becoming a pivotal solution for boosting performance, scalability, and adaptability in contemporary data centers. By breaking down traditional monolithic designs into smaller, either heterogeneous or homogeneous dies (also known as chiplets), engineers can fine-tune each component for specific functions, resulting in notable im... » read more

← Older posts Newer posts →